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Interfacial adhesion of nanoporous zeolite thin films

Published online by Cambridge University Press:  01 February 2006

Lili Hu
Affiliation:
Department of Mechanical Engineering, University of California, Riverside, California 92521
Junlan Wang*
Affiliation:
Department of Mechanical Engineering, University of California, Riverside, California 92521
Zijian Li
Affiliation:
Department of Chemical and Environmental Engineering, University of California, Riverside, California 92521
Shuang Li
Affiliation:
Department of Chemical and Environmental Engineering, University of California, Riverside, California 92521
Yushan Yan
Affiliation:
Department of Chemical and Environmental Engineering, University of California, Riverside, California 92521
*
a)Address all correspondence to this author. e-mail: wang@engr.ucr.edu
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Abstract

Nanoporous silica zeolite thin films are promising candidates for future generation low-dielectric constant (low-k) materials. During the integration with metal interconnects, residual stresses resulting from the packaging processes may cause the low-k thin films to fracture or delaminate from the substrates. To achieve high-quality low-k zeolite thin films, it is important to carefully evaluate their adhesion performance. In this paper, a previously reported laser spallation technique is modified to investigate the interfacial adhesion of zeolite thin film-Si substrate interfaces fabricated using three different methods: spin-on, seeded growth, and in situ growth. The experimental results reported here show that seeded growth generates films with the highest measured adhesion strength (801 ± 68 MPa), followed by the in situ growth (324 ± 17 MPa), then by the spin-on (111 ± 29 MPa). The influence of the deposition method on film–substrate adhesion is discussed. This is the first time that the interfacial strength of zeolite thin films-Si substrates has been quantitatively evaluated. This paper is of great significance for the future applications of low-k zeolite thin film materials.

Type
Articles
Copyright
Copyright © Materials Research Society 2006

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