Abstract
Several conductive structures which appeared to be usable as base electrodes in VLSI capacitors based on high dielectric materials have been annealed in oxygen at 650 °C. The studied structures were Pt/TiN, Pt/Ta, Au/TiN, Ru, and RuO2/Ru, prepared under a variety of conditions. The structures have been studied by Rutherford backscattering (RBS) and Auger Electron Spectroscopy (AES). It was found that none of the pure metals, Pt, Au, or Ru, can prevent the diffusion of oxygen to the underlying layer and its oxidation, thus causing a possible break in the electrical conduction path to the silicon substrate. Of the investigated materials, in the thickness range ≤ 110 nm only the RuO2/Ru couple preserved its electrical connectivity to the Si substrate and prevented diffusion of silicon to the surface of the electrode.
Similar content being viewed by others
References
M. Okuyama and Y. Hamakawa, Int. J. Eng. Sci . 29 (3), 391–400 (1991).
G. H. Haertling, J. Vac. Sci. Technol . A 9 (3, pt. 1), 414 (1991).
K. Koyama, T. Sakuma, S. Yamamichi, H. Watanabe, H. Aoki, S. Ohya, Y. Miyasaka, and T. Kikkawa, IEEE IEDM 91 91, 823 (1991).
M. Sayer, IEEE Ultrasonics ’91 Symposium, Lake Buena Vista, FL, Dec. 8-11, 1991 (1991?).
P.D. Hren, S.H. Rou, H. Al Shareef, M. Ameen, O. Auciello, and A. Kingon, Ferroelectrics 116 (1991).
R. Bruchhaus, D. Pitzer, O. Eibl, U. Scheithauer, and W. Hoesler, in Ferroelectric Thin Films II, edited by A. I. Kingon, E. R. Myers, and B. Turtle (Mater. Res. Soc. Symp. Proc. 243, Pittsburgh, PA, 1991).
T. Ogawa, Integrated Ferroelectrics 1, 1 (1992).
S. Yamamichi, T. Sakuma, K. Takemura, and Y. Miyasaka, Jpn. J. Appl. Phys . 30, 2193 (1991).
K. Takemura, Proc. 4th Int. Symp. on Integrated Ferroelectrics, Monterey, CA, March 9–11, 1992 (1992).
L. Krusin-Elbaum, M. Wittmer, and D. S. Yee, Appl. Phys. Lett . 26, 1879 (1987).
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Grill, A., Kane, W., Viggiano, J. et al. Base electrodes for high dielectric constant oxide materials in silicon technology. Journal of Materials Research 7, 3260–3265 (1992). https://doi.org/10.1557/JMR.1992.3260
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1557/JMR.1992.3260