Hostname: page-component-7c8c6479df-fqc5m Total loading time: 0 Render date: 2024-03-28T18:22:18.758Z Has data issue: false hasContentIssue false

Diffusional Phase Transformation under Induced Thermal Stress

Published online by Cambridge University Press:  26 July 2012

E C Zingu
Affiliation:
Department of Physics, Medunsa, 0204, South Africa
B T Mofokeng
Affiliation:
Department of Physics, Medunsa, 0204, South Africa
Get access

Abstract

When thin films are deposited on substrates or when compound films are formed through interdiffusion of multi-film structures, intrinsic stress develops in the various films. Thermal mismatch between the expansion coefficients of the substrate and films in multi-film structures gives rise to extrinsic stress at elevated temperatures

By using Si<100> and rolled Al foil substrates supporting the same multi-film structure SiO2/Si/Co, the effect of extrinsic stress on interdiffusion of thin films is isolated.

Silicide growth is found to be inhibited (delayed) when formed on Al substrates compared to that formed on Si substrates. The delay in silicide growth is ascribed to delamination caused by large tensile stress prior to silicide formation. The growth rate of Co2Si is found to be similar on both Al and Si substrates

Type
Research Article
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Chopra, K L, Thin film Phenomena, (New York, McGraw Hill, 1969)Google Scholar
2. Townsend, P H, Barnett, D M and Brunner, T A, J. Appl. Phys. 62 (1987) 4438 Google Scholar
3. Nicolet, M A and Lau, S S in VLSI Electronics : Microstructure Science, edited by Einspruch, N G and Larrabee, G B,(Academic Press, New York, 1983)Google Scholar
4. Gurp, G J van, Weg, W F van der and Sigurd, D, J. Appl. Phys. 49, 4011 (1978)Google Scholar
5. Fargeix, A and Ghibaudo, G, J. Appl. Phys. 54, 7153 (1983)Google Scholar
6. Allman, M von, Lau, S S and Nicolet, M in Thin Film Interfaces and Interactions, edited by Baglin, J and Poate, J, (Electrochem. Soc., Manchester, 1980) 364 Google Scholar
7. Martinez, A, Esteve, D, Guivarch, A, Henoc, P and Pelosis, G, Solid State Electronics, 23, 55 (1980)Google Scholar
8. Lien, C D, Nicolet, M A, Pai, C S and Lau, S S, Appl. Phys. A 36, 153 (1985)Google Scholar