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Effect of Solid-Solution W Addition on the Nanostructure of Electrodeposited Ni

Published online by Cambridge University Press:  11 February 2011

Hajime Iwasaki
Affiliation:
Department of Materials Science & Engineering, Himeji Institute of Technology, 2167 Shosha, Himeji, Hyogo 671–2201, Japan
Kenji Higashi
Affiliation:
Department of Metallurgy and Materials Science, College of Engineering, Osaka Prefecture University, Sakai 599–8531, Japan
T. G. Nieh
Affiliation:
Lawrence Livermore National Laboratory, L-350, PO Box 808, Livermore, CA 94551, USA
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Abstract

Electrodeposition method was employed to produce freestanding Ni-W alloy foils. The foils consist of nanograins. The structure of the foil, e.g. texture, grain morphology, size distribution, and the nature of grain boundaries, were characterized using X-ray diffraction and high-resolution electron microscopy. The deposited foils exhibit an equiaxed nanocrystalline structure having a grain size value of about 6 nm. Two types of grain boundary structure were observed. One type of grain boundary is essentially one atomic layer thin and another type consists of a structureless layer of about 0.5–1 nm in thickness. Angular dark field (Z-contrast) image of the deposited foils showed an inhomogeneous distribution of W solutes. In some local regions, the W content actually exceeds the equilibrium solid solution limit. Many grain boundaries with a structureless layer of about 0.5–1 nm are probably a result of local supersaturation of W.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

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