Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-19T07:42:42.378Z Has data issue: false hasContentIssue false
  • English
  • Français

Non-octahedral-like dislocation glides in aluminum induced by athermal effect of electric pulse

Published online by Cambridge University Press:  17 March 2016

Wei Li ,
Yao Shen ,
Haiting Liu ,
Yuan Wang ,
Wenjun Zhu  and
Chaoying Xie
Wei Li
Affiliation:
State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China; and Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Yao Shen*
Affiliation:
State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China; and Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Haiting Liu
Affiliation:
State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China; and Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
Yuan Wang
Affiliation:
National Key Laboratory of Shock Wave and Detonation Physics, Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, Sichuan, People's Republic of China
Wenjun Zhu
Affiliation:
National Key Laboratory of Shock Wave and Detonation Physics, Institute of Fluid Physics, China Academy of Engineering Physics, Mianyang 621900, Sichuan, People's Republic of China
Chaoying Xie
Affiliation:
State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China; and Shanghai Key Laboratory of Advanced High-temperature Materials and Precision Forming, Shanghai Jiao Tong University, Shanghai 200240, People's Republic of China
*
a) Address all correspondence to this author. e-mail: yaoshen@sjtu.edu.cn
Get access

Abstract

The dislocation movements under the action of electric pulses (athermal effect) at cryogenic conditions were studied by ex situ transmission electron microscopy (TEM) observations and slip trace analysis innovatively. By applying electric pulses directly through aluminum TEM samples in a liquid nitrogen bath, plenty of non-octahedral-like dislocation glides generally forming at high temperatures (e.g., >453 K for aluminum) were observed at cryogenic temperatures (<130 K). Occurrence of the non-octahedral-like dislocation glides indicates a substantial increase in the degrees of freedom for dislocation glides, offering a new/complementary explanation for the acceleration effect of electric pulses on dislocation movements, especially in the sole athermal effect. In comparison, previous theories relied on extra driving force and/or increased dislocation mobility on the octahedral planes in a face-centered cubic metal. The athermal effects of electric pulse were discussed and the selective heating at the dislocation cores was proposed to account for non-octahedral-like dislocation glides.

Keywords

Aldislocationstransmission electron microscopy (TEM)
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 9 , 14 May 2016 , pp. 1193 - 1200
Copyright
Copyright © Materials Research Society 2016 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Li, W., Shen, Y., and Xie, C.: Effects of electric pulses on annealing hardening of submicrometre grained copper. Mater. Sci. Technol. 31(13), 1577 (2015).CrossRefGoogle Scholar
Conrad, H., Karam, N., Mannan, S., and Sprecher, A.F.: Effect of electric current pulses on the recrystallization kinetics of copper. Scr. Mater. 22, 235 (1988).Google Scholar
Guan, L., Tang, G., and Chu, P.K.: Recent advances and challenges in electroplastic manufacturing processing of metals. J. Mater. Res. 25(07), 1215 (2011).CrossRefGoogle Scholar
Xu, Q., Guan, L., Jiang, Y., Tang, G., and Wang, S.: Improved plasticity of Mg–Al–Zn alloy by electropulsing tension. Mater. Lett. 64(9), 1085 (2010).CrossRefGoogle Scholar
Tang, G., Zhang, J., Yan, Y., Zhou, H., and Fang, W.: The engineering application of the electroplastic effect in the cold-drawing of stainless steel wire. J. Mater. Process. Technol. 137(1–3), 96 (2003).CrossRefGoogle Scholar
Bhadeshia, H.K.D.H.: The electrical processing of materials. Mater. Sci. Technol. 31(13), 1521 (2015).CrossRefGoogle Scholar
Li, X., Wang, F., Li, X., Tang, G., and Zhu, J.: Improvement of formability of Mg–3Al–1Zn alloy strip by electroplastic-differential speed rolling. Mater. Sci. Eng., A 618, 500 (2014).CrossRefGoogle Scholar
Baranov, S.A., Staschenko, V.I., Sukhov, A.V., Troitskiy, O.A., and Tyapkin, A.V.: Electroplastic metal cutting. Russ. Electr. Eng. 82(9), 477 (2011).CrossRefGoogle Scholar
Nguyen-Tran, H-D., Oh, H-S., Hong, S-T., Han, H.N., Cao, J., Ahn, S-H., and Chun, D-M.: A review of electrically-assisted manufacturing. Int. J. Precis. Eng. Manuf. Technol. 2(4), 365 (2015).CrossRefGoogle Scholar
Xu, Z., Tang, G., Tian, S., Ding, F., and Tian, H.: Research of electroplastic rolling of AZ31 Mg alloy strip. J. Mater. Process. Technol. 182(1–3), 128 (2007).CrossRefGoogle Scholar
Song, H. and Wang, Z-j.: Effect of electropulsing on dislocation mobility of titanium sheet. Trans. Nonferrous Met. Soc. China 22(7), 1599 (2012).CrossRefGoogle Scholar
Stolyarov, V.V.: Electroplastic effect in nanostructured titanium alloys. Rev. Adv. Mater. Sci. 31, 163 (2012).Google Scholar
Troitskii, O.A. and Likhtman, V.I.: Anisotropy of the effect of electronic and irradiation on the process of deformation of zinc single crystals in the brittle state. Dokl. Akad. Nauk SSSR 148, 332 (1963).Google Scholar
Sprecher, A.F., Mannan, S.L., and Conrad, H.: Overview no. 49 on the mechanisms for the electroplastic effect in metals. Acta Mater. 37(7), 1145 (1986).CrossRefGoogle Scholar
Boiko, Y.I., Geguzin, Y.E., and Klinchuk, Y.I.: Drag of dislocations by an electron wind in metals. Zh. Eksp. Teor. Fiz. 81, 2175 (1981).Google Scholar
Suo, Z.: Dislocation climb in the electron wind. Mater. Res. Soc. Symp. Proc. 338, 379 (1994).CrossRefGoogle Scholar
Nam, S.W., Chung, H.S., Lo, Y.C., Qi, L., Li, J., Lu, Y., Johnson, A.T., Jung, Y., Nukala, P., and Agarwal, R.: Electrical wind force-driven and dislocation-templated amorphization in phase-change nanowires. Science 336(6088), 1561 (2012).CrossRefGoogle ScholarPubMed
Stolyarov, V.V.: Electroplastic effect in nanocrystalline and amorphous alloys. Mater. Sci. Technol. 31(13), 1536 (2015).CrossRefGoogle Scholar
Molotskii, M.I. and Fleurov, V.: Magnetic effects in electroplasticity of metals. Phys. Rev. B. 52, 15829 (1995).CrossRefGoogle ScholarPubMed
Molotskii, M.I.: Possible mechanism of the magetoplastic effect. Sov. Phys. Solid State 33, 1760 (1991).Google Scholar
Molotskii, M.I.: Negative magnetoplastic effect in nonmagnetic crystals. Phys. Solid State 35, 5 (1993).Google Scholar
Stashenko, V.I. and Troitskii, O.A.: Influence of pulsed current peak on the creep rate of zinc crystals. Strength Mater. 14, 1337 (1982).CrossRefGoogle Scholar
Desai, P.D., James, H.M., and Ho, C.Y.: Electric resistivity of aluminum and manganese. J. Phys. Chem. Ref. Data 13, 1131 (1984).CrossRefGoogle Scholar
Hibbit, H.D., Karlsson, B.I., Sorensen, E.P.: ABAQUS User Manual, Version 6.12. (Simulia, Providence, 2012).Google Scholar
Caillard, D. and Martin, J.L.: Microstructure of aluminium during creep at intermediate temperatures—III. The rate controlling process. Acta Metall. 31, 813 (1983).CrossRefGoogle Scholar
Caillard, D. and Martin, J.L.: Microstructure of aluminium during creep at intermediate temperature—II. In situ study of subboundary properties. Acta Metall. 30, 791 (1982).CrossRefGoogle Scholar
Caillard, D. and Martin, J.L.: Microstructure of aluminium during creep at intermediate temperature—I. dislocation networks after creep. Acta Metall. 30, 437 (1981).CrossRefGoogle Scholar
Caillard, D. and Martin, J.L.: Glide of dislocations in non-octahedral planes of fcc metals: A review. Int. J. Mater. Res. 100, 1403 (2009).CrossRefGoogle Scholar
Carrard, M. and Martin, J.L.: A study of (001) glide in [112] aluminium single crystals II. Microscopic mechanism. Philos. Mag. A 58(3), 491 (1988).CrossRefGoogle Scholar
Carrard, M. and Martin, J.L.: A study of (001) glide in [112] aluminium single crystals I. Creep charateristics. Philos. Mag. A 56(3), 391 (1987).CrossRefGoogle Scholar
Okazaki, K., Kagawa, M., and Conrad, H.: An evaluation of the contributions of skin, pinch and heating effects to the electroplastic effect in titatnium. Mater. Sci. Eng. 45, 109 (1980).CrossRefGoogle Scholar
Zhang, W., Sui, M.L., Zhou, Y.Z., and Li, D.X.: Evolution of microstructures in materials induced by electropulsing. Micron 34(3–5), 189 (2003).CrossRefGoogle ScholarPubMed
Kamimura, Y., Edagawa, K., and Takeuchi, S.: Experimental evaluation of the Peierls stresses in a variety of crystals and their relation to the crystal structure. Acta Mater. 61, 294 (2013).CrossRefGoogle Scholar
Caillard, D., Legros, M., and Couret, A.: Extrinsic obstacles and loop formation in deformed metals and alloys. Phlos. Mag. 93(1–3), 203 (2013).CrossRefGoogle Scholar
Wert, C. and Thomson, R.: Solid State Physics (Mir, Moscow City, 1969).Google Scholar