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Analysis of failure of C-V characteristics of MIS structure with SiO2 passivation layer deposited on InSb substrate via Raman spectroscopy

Published online by Cambridge University Press:  22 May 2014

Chulkyun Seok
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Korea.
Sujin Kim
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Korea.
Jaeyel Lee
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Korea.
Sehun Park
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Korea.
Yongjo Park*
Affiliation:
Advanced Institutes of Convergence Technology, Seoul National University, Korea.
Euijoon Yoon*
Affiliation:
Department of Materials Science and Engineering, Seoul National University, Korea.
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Abstract

The effect of interfacial phases on the electrical properties of Au/Ti/SiO2/InSb metal-insulator (oxide)-semiconductor (MIS or MOS) structures was investigated by capacitance-voltage (C-V) measurements. With increasing the deposition temperature of silicon oxide from 100 to 350°C using PECVD, the change in the interfacial phases between SiO2 and InSb were analyzed by resonant Raman spectroscopy to verify the relation between the breakdown of C-V characteristics and the change of interfacial phases. The shape of C-V characteristics was dramatically changed when the deposition temperature was above 300°C. The C-V measurements and Raman spectra represented that elemental Sb accumulation resulted from the chemical reaction of Sb oxide with InSb substrate was responsible for the failure in the C-V characteristics of MIS structure.

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Articles
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

Bloom, I., Nemirovsky, Y., IEEE Trans. Electron Devices 40, 309 (1993).10.1109/16.182506CrossRefGoogle Scholar
Rogalski, A., Prog Quantum Electron 27, 59 (2003).10.1016/S0079-6727(02)00024-1CrossRefGoogle Scholar
Woo, J., Chun, Y., Joo, Y., and Kim, C., Appl. Phys. Lett. 100, 081101 (2012).10.1063/1.3687702CrossRefGoogle Scholar
Kim, S. J., Li, M., Ding, S., Zhu, C., Yu, M. B., Narayanan, B., Chin, A., and Kwong, D., IEEE Electron Device Lett., Vol. 25, No. 8 (2004).Google Scholar
Kim, S. J., Cho, B. J., Li, M., Ding, S., Yu, M., Zhu, C.. Chin, A., and Kwong, D., Symposium on VLSI Technology Digest of Technical Papers, p218219 (2004).Google Scholar
Richter, W. and McGilp, J. F., Phil. Trans. R. Soc. Lond. A 344, p453467 (1993).Google Scholar
Lee, J., Park, S., Kim, J., Yang, C., Kim, S., Seok, C., Park, J., and Yoon, E., Thin Solid Films 520, 53825385 (2012).10.1016/j.tsf.2012.04.007CrossRefGoogle Scholar