Hostname: page-component-76fb5796d-zzh7m Total loading time: 0 Render date: 2024-04-25T09:05:12.900Z Has data issue: false hasContentIssue false
  • English
  • Français

Creating textured surfaces using plasma electrolysis

Published online by Cambridge University Press:  13 December 2013

Zhiling Zhang ,
Mukul Dubey ,
David Galipeau ,
Qi Hua Fan ,
James D. Hoefelmeyer  and
Ilham Y. Al-Qaradawi
Zhiling Zhang
Affiliation:
Department of Electrical Engineering and Computer Science, South Dakota State University, Brookings, South Dakota 57007
Mukul Dubey
Affiliation:
Department of Electrical Engineering and Computer Science, South Dakota State University, Brookings, South Dakota 57007
David Galipeau
Affiliation:
Department of Electrical Engineering and Computer Science, South Dakota State University, Brookings, South Dakota 57007
Qi Hua Fan*
Affiliation:
Department of Electrical Engineering and Computer Science, South Dakota State University, Brookings, South Dakota 57007
James D. Hoefelmeyer
Affiliation:
Department of Chemistry, University of South Dakota, Vermillion, South Dakota 57069
Ilham Y. Al-Qaradawi
Affiliation:
Physics Department, Qatar University, P. O. Box 2713, Doha, Qatar
*
Address all correspondence to Qi Hua Fan atqihua.fan@sdstate.edu
Get access

Abstract

Plasma electrolysis (PE) is a combination of electrolysis and plasma discharge. Previous studies indicated that PE usually created porous surface with irregular morphology as a result of the plasma–cathode interaction that was dominated by physical reactions. This paper demonstrated that highly ordered textured silicon surfaces could be created using PE. This abnormal anisotropic etching phenomenon implied that the chemical reactions were decoupled from the physical processes and the physical reactions were suppressed. Raman spectra confirmed that the textured silicon surface created by PE conserved the crystalline structure. Therefore, PE may lead to new process regimes for surface engineering.

Type
Research Letters
Information
MRS Communications , Volume 3 , Issue 4 , December 2013 , pp. 255 - 258
Copyright
Copyright © Materials Research Society 2013 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Belevantsev, V.I., Terleeva, O.P., Markov, G.A., Shulepko, E.K., Slonova, A.I., and Utkin, V.V.: Micro-plasma electrochemical processes. Prot. Met. 34, 416 (1998).Google Scholar
2.Yerokhin, A.L., Nie, X., Leyland, A., Matthews, A., and Dowey, S.J.: Plasma electrolysis for surface engineering. Surf. Coat. Technol. 122, 73–93 (1999).CrossRefGoogle Scholar
3.Gupta, P., Tenhundfeld, G., Daigle, E.O., and Ryabkov, D.: Electrolytic plasma technology: science and engineering—an overview. Surf. Coat. Technol. 201, 8746 (2007).CrossRefGoogle Scholar
4.Gupta, P. and Tenhundfeld, G.: Surface and mechanical properties of steel processed by electro-plasma technology. Plating Surf. Finishing 92, 48 (2005).Google Scholar
5.Gupta, P., Tenhundfeld, G., Daigle, E.O., and Schilling, P.J.: Synthesis and characterization of hard metal coatings by electro-plasma technology. Surf. Coat. Technol. 200, 1587 (2005).Google Scholar
6.Belkin, P.N., Pasinkovskii, E.A., Tkachenko, Y.G., Faktarovich, A.A., and Yulyugin, V.K.: Effect of nitriding in an electrolytic plasma on the friction characteristics of 40 Kh steel. Elektron. Obrab. Mater. 4, 43 (1981).Google Scholar
7.Kellogg, H.H.: Anode effect in aqueous electrolysis. J. Electrochem. Soc. 97, 133 (1950).Google Scholar
8.Hickling, A.: Mod. Aspects Electrochem. No. 6 (Plenum Press, New York, USA, 1971), pp. 329–373.Google Scholar
9.Hickling, A. and Ingram, M.D.: Glow-discharge electrolysis. J. Electroanal. Chem. 8, 65 (1964).Google Scholar
10.Sengupta, S.K. and Singh, O.P.: Contact glow discharge electrolysis: a study of its chemical yields in aqueous inert-type electrolytes. J. Electroanal. Chem. 369, 113 (1994).CrossRefGoogle Scholar
11.Sengupta, S.K. and Singh, O.P.: Contact glow discharge electrolysis: a study of its onset and location. J. Electroanal. Chem. Interfacial Electrochem. 301, 189 (1991).Google Scholar
12.Sengupta, S.K., Singh, R., and Srivastava, A.K.: A study on the origin of nonfaradaic behavior of anodic contact glow discharge electrolysis: the relationship between power dissipated in glow discharges and nonfaradaic yields. J. Electrochem. Soc. 145, 2209 (1998).Google Scholar
13.Sengupta, S.K., Srivastava, A.K., and Singh, R.: Contact glow discharge electrolysis: a study on its origin in the light of the theory of hydrodynamic instabilities in local solvent vaporisation by Joule heating during electrolysis. J. Electroanal. Chem. 427, 23 (1997).Google Scholar
14.Gupta, S.K.S., Srivastava, A.K., and Singh, R.: Origin of contact glow discharge electrolysis in aqueous solutions: effects of electrolyte temperature and surface tension. Indian J. Chem., Sect. A: Inorg., Bio-inorg., Phys., Theor. Anal. Chem. 36A, 945 (1997).Google Scholar
15.Shih, K.-Y. and Locke, B.R.: Effects of electrode protrusion length, pre-existing bubbles, solution conductivity and temperature, on liquid phase pulsed electrical discharge. Plasma Process. Polym. 6, 729 (2009).CrossRefGoogle Scholar
16.Aliofkhazraei, M., Rouhaghdam, A.S., and Gupta, P.: Nano-fabrication by cathodic plasma electrolysis. Crit. Rev. Solid State Mater. Sci. 36, 174 (2011).Google Scholar
17.Toriyabe, Y., Watanabe, S., Yatsu, S., Shibayama, T., and Mizuno, T.: Controlled formation of metallic nanoballs during plasma electrolysis. Appl. Phys. Lett. 91, 041501 (2007).Google Scholar
18.Dunleavy, C.S., Golosnoy, I.O., Curran, J.A., and Clyne, T.W.: Characterisation of discharge events during plasma electrolytic oxidation. Surf. Coat. Technol. 203, 3410 (2009).Google Scholar
19.Campbell, P. and Green, M.A.: Light trapping properties of pyramidally textured surfaces. J. Appl. Phys. 62, 243 (1987).CrossRefGoogle Scholar
20.Papet, P., Nichiporuk, O., Kaminski, A., Rozier, Y., Kraiem, J., Lelievre, J.F., Chaumartin, A., Fave, A., and Lemiti, M.: Pyramidal texturing of silicon solar cell with TMAH chemical anisotropic etching. Sol. Energy Mater. Sol. Cells 90, 2319 (2006).Google Scholar
21.Ou, W., Zhao, L., Diao, H., Zhang, J., and Wang, W.: Optical and electrical properties of porous silicon layer formed on the textured surface by electrochemical etching. J. Semicond. 32, 056002 (2011).Google Scholar
22.Russell, J.P.: Raman scattering in silicon. Appl. Phys. Lett. 6, 223 (1965).CrossRefGoogle Scholar
23.Klapkiv, M.D.: State of an electrolytic plasma in the process of synthesis of oxides based on aluminum. Mater. Sci. 31, 494 (1996).Google Scholar
24.Allongue, P., Costa-Kieling, V., and Gerischer, H.: Etching of silicon in NaOH solutions. J. Electrochem. Soc. 140, 1009 (1993).Google Scholar
25.Baum, T. and Schiffrin, D.J.: Kinetic isotopic effects in the anisotropic etching of p-Si <100> in alkaline solutions. J. Electroanal. Chem. 436, 239 (1997).Google Scholar
26.Baum, T. and Schiffrin, D.J.: Mechanistic aspects of anisotropic dissolution of materials etching of single-crystal silicon in alkaline solutions. J. Chem. Soc., Faraday Trans. 94, 691 (1998).CrossRefGoogle Scholar
27.Vallejo, B., González-Mañas, M., Martínez-López, J., and Caballero, M.A.: On the texturization of monocrystalline silicon with sodium carbonate solutions. Sol. Energy 81, 565 (2007).CrossRefGoogle Scholar