MRS Proceedings


Electrochemical Deposition of Bismuth Micro- and Nanowires Using Electroplate and Lift Lithography

IMRC 2012.

Timea Hohla1a2, Lori A. Lepaka1, Andrew Zimmermana1 *, Samuel Hempela1 *, Anirudha V. Sumanta3, Ralu Divana3, C. Suzanne Millera3, Daniel Rosenmanna3, Christopher Verzania1, Endre Takácsa2 and Michael P. Zacha1

a1 University of Wisconsin – Stevens Point, WI 54481, U.S.A.

a2 University of Debrecen, Debrecen, H-4010, Hungary

a3 Center for Nanoscale Materials, Argonne National Laboratory, IL 60439, U.S.A.


Patterned micro- and nanowires of several compositions in the solution series of BixTey were electrochemically deposited using Electroplate and Lift (E&L) Lithography on Ultrananocrystalline Diamond (UNCD) templates. The composition of the deposited BixTey wires was controlled by mixing saturated solutions of bismuth nitrate and tellurium in various ratios in the electroplating bath. All wires were electroplated via pulsed depositions at -1.4V vs. the saturated calomel electrode (SCE). The morphology and composition of all wires were studied by scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). In general, the BixTey wires were fine-grained and brittle, often fracturing during the liftoff process. By contrast, wires containing less than 5% Te are smooth, and strong enough to support their own weight without a supporting medium for a length of over 100 times the wire diameter.

Key Words:

  • electrochemical synthesis;
  • lithography (deposition);
  • Bi


*  denotes undergraduate student