Hostname: page-component-8448b6f56d-qsmjn Total loading time: 0 Render date: 2024-04-19T20:25:01.076Z Has data issue: false hasContentIssue false

Interactions between lead oxide and ceramic substrates for thick film technology

Published online by Cambridge University Press:  26 July 2012

Massimo Bersani
Affiliation:
Istituto Nazionale per la Fisica della Materia (INFM) and Department of Physics, University of Modena, 41100 Modena, Italy
Bruno Morten
Affiliation:
Istituto Nazionale per la Fisica della Materia (INFM) and Department of Physics, University of Modena, 41100 Modena, Italy
Maria Prudenziati
Affiliation:
Istituto Nazionale per la Fisica della Materia (INFM) and Department of Physics, University of Modena, 41100 Modena, Italy
Alessandro Gualtieri
Affiliation:
Department of Earth Sciences, University of Modena, 41100 Modena, Italy
Get access

Abstract

This paper deals with the mechanisms and kinetics of interactions between screen printed and fired PbO layers and ceramic substrates: alumina and beryllia. The interaction with alumina occurs via two main processes: (i) a reaction between PbO and Al2O3 grains, which induces the formation of a crystalline phase, Pb2Al2O5; and (ii) an interdiffusion process involving Pb and the intergranular amorphous phase in the ceramic substrate. This latter process results in a compositional change of the intergranular phase at considerable depths inside the ceramic substrate, as well as in the formation of a high lead glass layer on the substrate surface. Since PbO is not completely reacted, the Pb penetration in the ceramic is diffusion limited (penetration depth , where td is the reaction time) with an activation energy of 1.20 ± 0.05 eV. The ceramic microstructure significantly affects the interaction processes.

Type
Articles
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Jones, R. D., Hybrid Circuit Design and Manufacture (Marcel Dekker, New York, 1982).Google Scholar
2.Thick Film Sensors, edited by Prudenziati, M. (Elsevier, Amsterdam, 1994).Google Scholar
3.Prudenziati, M., Morten, B., and Brigatti, M. L., Active Passive Electr. Comp. 12, 41 (1985).CrossRefGoogle Scholar
4.Prudenziati, M., Morten, B., Cilloni, F., Ruffi, G., and Sacchi, M., J. Appl. Phys. 65, 146 (1989).CrossRefGoogle Scholar
5.Beraud, C., Courbiere, M., Esnouf, C., Juve, D., and Treheux, D., J. Mater. Sci. 24, 4545 (1989).CrossRefGoogle Scholar
6.Murayama, J., Ikezaki, H., Taninuji, N., and Kato, T., Proc. Int. Symp. Microelectronics (ISHM, Reston, Vancouver, 1990), p. 303.Google Scholar
7.Klomp, J. T., Ceram. Bull. 51, 683 (1972).Google Scholar
8.Pepper, S. V., J. Appl. Phys. 47, 801 (1976).CrossRefGoogle Scholar
9.Ohuchi, F. S., J. Am. Ceram. Soc. 74, 1163 (1991).CrossRefGoogle Scholar
10.Twentyman, M. E., J. Mater. Sci. 10, 765 (1975).CrossRefGoogle Scholar
11.Mattox, D. M. and Smith, H. D., Ceram. Bull. 64, 1363 (1985).Google Scholar
12.Cole, S. S., Jr. and Sommer, G., J. Am. Ceram. Soc. 44, 265 (1961).CrossRefGoogle Scholar
13.Morten, B., DeCicco, G., Gandolfi, A. and Tonelli, C., Hybrid Circuits n.28, 25 (1992).Google Scholar
14.Liptay, G., Atlas of Thermoanalytical Curves (Heyden & Son, Ltd., London, 1971).Google Scholar
15.Sorrell, C. A., J. Am. Ceram. Soc. 55, 47 (1972).CrossRefGoogle Scholar
16.Wyckoff, R. W. G., Crystal Structures (John Wiley & Sons, New York, 1968).Google Scholar
17.Grove, A. S., Physics and Technology of Semiconductor Devices (John Wiley, New York, 1967), Chap. 2.Google Scholar