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Large-scale integration of single-walled carbon nanotubes and graphene into sensors and devices using dielectrophoresis: A review

Published online by Cambridge University Press:  04 July 2011

Brian R. Burg  and
Dimos Poulikakos
Brian R. Burg*
Affiliation:
Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, 8092 Zurich, Switzerland
Dimos Poulikakos*
Affiliation:
Laboratory of Thermodynamics in Emerging Technologies, Department of Mechanical and Process Engineering, 8092 Zurich, Switzerland
*
b)Address all correspondence to these authors. e-mail: bburg@mit.edu
c)e-mail: dimos.poulikakos@ethz.ch
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Abstract

Device and sensor miniaturization has enabled extraordinary functionality and sensitivity enhancements over the last decades while considerably reducing fabrication costs and energy consumption. The traditional materials and process technologies used today will, however, ultimately run into fundamental limitations. Combining large-scale directed assembly methods with high-symmetry low-dimensional carbon nanomaterials is expected to contribute toward overcoming shortcomings of traditional process technologies and pave the way for commercially viable device nanofabrication. The purpose of this article is to review the guided dielectrophoretic integration of individual single-walled carbon nanotube (SWNT)- and graphene-based devices and sensors targeting continuous miniaturization. The review begins by introducing the electrokinetic framework of the dielectrophoretic deposition process, then discusses the importance of high-quality solutions, followed by the site- and type-selective integration of SWNTs and graphene with emphasis on experimental methods, and concludes with an overview of dielectrophoretically assembled devices and sensors to date. The field of dielectrophoretic device integration is filled with opportunities to research emerging materials, bottom–up integration processes, and promising applications. The ultimate goal is to fabricate ultra-small functional devices at high throughput and low costs, which require only minute operation power.

Keywords

MicroelectromechanicalmSensorSolution deposition
Type
Invited Feature Paper
Information
Journal of Materials Research , Volume 26 , Issue 13 , 14 July 2011 , pp. 1561 - 1571
Copyright
Copyright © Materials Research Society 2011

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