Hostname: page-component-76fb5796d-dfsvx Total loading time: 0 Render date: 2024-04-25T08:47:43.230Z Has data issue: false hasContentIssue false

Ellipsometry as a Sensitive Technique to Probe film -Substrate Interfaces: Al2O3 on Si(100)

Published online by Cambridge University Press:  21 March 2011

M. P. Singh
Affiliation:
Materials Research Centre, Indian Institute of Science, Bangalore, India
G. Raghavan
Affiliation:
Indira Gandhi Centre for Atomic Research, Kalpakkam, India
A. K. Tyagi
Affiliation:
Indira Gandhi Centre for Atomic Research, Kalpakkam, India
S. A. Shivashankar
Affiliation:
Materials Research Centre, Indian Institute of Science, Bangalore, India
Get access

Abstract

An attempt has been made to study the film-substrate interface by using a sensitive, non- conventional tool. Because of the prospective use of gate oxide in MOSFET devices, we have chosen to study alumina films grown on silicon. Film-substrate interface of alumina grown by MOCVD on Si(100) was studied systematically using spectroscopic ellipsometry in the range 1.5-5.0 eV, supported by cross-sectional SEM, and SIMS. The (ε12) versus energy data obtained for films grown at 600°C, 700°C, and 750°C were modeled to fit a substrate/interface/film “sandwich”. The experimental results reveal (as may be expected) that the nature of the substrate -film interface depends strongly on the growth temperature. The simulated (ε12) patterns are in excellent agreement with observed ellipsometric data. The MOCVD precursors results the presence of carbon in the films. Theoretical simulation was able to account for the ellipsometry data by invoking the presence of “free” carbon in the alumina films.

Type
Research Article
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ludeke, R., Cuberes, M. T., and Cartier, E., Appl. Phys. Lett.,76, 2886 (2000).Google Scholar
2. Klein, T. M., Niu, D., Epling, W. S., Li, W., Maher, D. M., Hobbs, C. C., Hegde, R. I., Baumvol, I. J. R., and Parsons, G. N., Appl. Phys. Lett., 75, 4001 (1999).Google Scholar
3. Pande, K. P., Nair, V. K. R., and Gutierrez, D., J. Appl. Phys. 54, 5436 (1983).Google Scholar
4. Kobayashi, T., Okamura, M., Yamaguchi, E., Shinoda, Y., and Hirota, Y., J. Appl. Phys., 52, 6434 (1985).Google Scholar
5. Zhao, Yu. Wen, Suhr, H., Appl. Phys. A, 55, 176 (1992).Google Scholar
6. Smit, M. K., Acket, G. A., Laan, C. J. Van Der, Thin Solid Films, 138, 171 (1986).Google Scholar
7. Azzam, R.M.A. and Bashara, N.M., Ellipsometry and Polarized Light (North-Holland, 1989), Chapter 3.Google Scholar
8. Singh, M. P., Mukhopadhayay, S., Subbanna, G. N., and Shivashankar, S. A. (Communicated to Thin Solid Films).Google Scholar
9. Bruggeman, D. A. G., Ann. Phys. 24, 636 (1935).Google Scholar