Hostname: page-component-8448b6f56d-c47g7 Total loading time: 0 Render date: 2024-04-19T01:53:21.675Z Has data issue: false hasContentIssue false

Mechanical Behavior of Materials in Microelectronic and Fiber-Optic Structures: Application of Analytical Modeling - Review

Published online by Cambridge University Press:  26 February 2011

E. Suhir*
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey, U.S.A
Get access

Extract

The overwhelming majority of studies in microelectronics and fiber-optics are experimental. Not too many apply numerical, mainly finite-element, methods to analyze microelectronic and fiberoptic structures. There is a very small number of papers using analytical modeling. At the same time application of powerful and well-developed analytical methods of Engineering Mechanics often enables one to obtain valuable prior information of the mechanical behavior of materials and structures, interpret empirical data, and to extrapolate the accumulated experience on new designs [1,2]. As a rule, application of analytical modeling results in better understanding of the behavior and performance of a material or structure, and in substantial savings of time and expense. This review, based primarily on the author's research, addresses several basic and practically important problems related to the mechanical behavior of materials and-rational structural design of microelectronic and fiber-optic systems and lending themselves to sufficiently simple analytical solutions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1) Suhir, E. (1989). “Analytical Modeling in Structural Analysis for Electronic Packaging: Its Merits, Shortcomings and Interaction with Experimental and Numerical Techniques”, Transactions ASME. J. Electr. Pack., vol. 111, 157161.Google Scholar
2) Suhir, E. (1991). “Structural Analysis in Microelectronic and Fiber-Optic Systems”. Van-Nostrand Reinhold, New York (to be published).Google Scholar
3) Timoshenko, S. (1925). “Analysis of Bi-Metal Thermostats”, J. Opt. Soc. of America, vol. 11, 233255.Google Scholar
4) Aleck, B. J. (1949). “Thermal Stresses in a Rectangular Plate Clamped Along an Edge”, ASME J. Appl. Mech., vol. 16, 118122.Google Scholar
5) Bogy, D. B. (1970). “On the Problem of Edge-Bonded Elastic Quarter-Planes Loaded at the Boundary”, Int. J. of Solids and Structures, vol. 6, 12871313.Google Scholar
6) Blech, J. J. and Kantor, Y. (1984) “An Edge Problem Having no Singularity at the Corner”, Computers and Structures, vol. 18, No. 4,609617.Google Scholar
7) Grimado, P. B. (1978) “Interlaminar Thermoelastic Stresses in Layered Beams”, J. Thermal Stresses, No. 1, 7586.Google Scholar
8) Chen, W. T. and Nelson, C. W. (1979) “Thermal Stress in Bonded Joints”, IBM J. Res. Devel., vol. 23, No. 2, 178188.Google Scholar
9) Suhir, E. (1986) “Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 53, 657660.Google Scholar
10) Suhir, E. (1989) “Thermally Induced Interfacial Stresses in Elongated Bi-Material Plates”, Applied Mechanics Reviews, vol. 42, No. 11, Part. 2, 253262.Google Scholar
11) Suhir, E. (1989) “Interfacial Stresses in Bi-Metal Thermostats”, ASME J. Appl. Mech., vol. 56, 595600.Google Scholar
12) Suhir, E. (1989) “Calculated Interfacial Stresses in Elongated Bi-Material Plates Subjected to Bending”, ASME J. of Electr. Pack., vol. 11, No. 4,277281.Google Scholar
13) Suhir, E. (1986) “Stresses in Adhesively Bonded Bi-Material Assemblies used in Electronic Packaging”, Materials Research Society Symposia Proceedings, Electronic Packaging Materials Science-II, vol. 72, 133138.Google Scholar
14) Suhir, E. (1986) “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies”, International Society for Hybrid Microelectronics, 1986 Symposium Proceedings, 383392.Google Scholar
15) Suhir, E. (1987) “Die Attachment Design and its Influence on Thermal Stresses in the Die and the Attachment”, 37-th Electronic Components Conference, 508517.Google Scholar
16) Suhir, E. (1988) “Thermal Stress Failures in Microelectronic Components - Review and Extension”, in the book “Advances in Thermal Modeling of Electronic Components and Systems”, ed. Bar-Cohen, A. and Kraus, A. D., Hemisphere, New York, 337412.Google Scholar
17) Suhir, E. and Lee, Y.-C. (1989) “Thermal, Mechanical and Environmental Durability Design Methodologies in Electronic Packaging”, in “Electronic Materials Handbook”, vol. 1, “Packaging”, ASM International, 4575.Google Scholar
18) Suhir, E. and Segelken, J. M. (1988) “Mechanical Behavior of Flip-Chip Encapsulants”, Semicon/East Techn. Proceedings, 33-45. See also ASME J. of Electronic Packaging vol. 112, No. 4, 327332.Google Scholar
19) Suhir, E. (1989) “Application of an Epoxy Cap in a Flip-Chip Package Design”, ASME J. Electron. Pack., vol. 111, 1620.Google Scholar
20) Suhir, E. and Poborets, B. (1990) “Solder Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability”, 40-th Electr. Comp. Conf., vol. 2, 10431053. See also ASME J. Electr. Pack., vol. 112, No. 3,204209.Google Scholar
21) Suhir, E. and Manzione, L. T.Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding”, ASME J. Electr. Pack., vol. 113, No. 1, 1620.Google Scholar
22) Suhir, E. and Manzione, L. T. “Mechanical Deformation of Lead Frame Assemblies in Plastic Packages During Molding”, ASME J. Electr. Pack., to be published.Google Scholar
23) Suhir, E. and Manzione, L. T. “Predicted Thermal Bow of a Large Plastic Package Due to the Non-Uniform Through-Thickness Distribution of Temperature”, ASME J. Electr. Pack., to be published.Google Scholar
24) Suhir, E. and Sullivan, T. M. “Predicted Bow of a HIC Premolded Lead Frame Assembly: Application of Finite-Element and Analytical Modeling”, ASME J. of Electr. Pack., to be published.Google Scholar
25) Suhir, E. and Sullivan, T. M. (1990) “Analysis of Interfacial Thermal Stresses and Adhesive Strength of Bi-Annular Cylinders”, Int. J. of Solids and Structures, vol. 26, No. 6, 581598.Google Scholar
26) Suhir, E. and Benedetto, W. (1987) “Mechanical Evaluation of the “Euler” Test Probe”, ASME Winter Annual Meeting, 87-WA/EEP-5, 1-3.Google Scholar
27) Suhir, E. (1990) “How Long Should Be a Beam Specimen in Bending Tests?”, ASME J. Electr. Pack., vol. 112, No. 1, 8385.Google Scholar
28) Suhir, E. (1991) “Double-Sided Velcro-Type Input/Output Contactor Interface Design: Mechanical Behavior of Elastic Contactors”, ASME J. Electr. Pack., vol. 112, No. 4, 383386.Google Scholar
29) Suhir, E. (1991) “A Plate Contactor in a Mechanical Input/Output Connector Element Interface: How Small Can It Be?”, ASME J. Electr. Pack. vol. 113, No. 1, 8183.Google Scholar
30) RUBll, K. (1976) “Analysis of Stress and Strain Distribution in Thin Films and Substrates”, J. Appl. Phys., vol. 47, No. 7, 32243229.Google Scholar
31) Olsen, G. H. and Ettenberg, M. (1977) “Calculated Stresses in Multilayered Heteroepitaxial Structures”, J. Appl. Phys., vol. 48, No. 6,25432547.Google Scholar
32) Suhir, E. (1987) “Stresses in Multilayered Thin Films on a Thick Substrate”, Materials Research Society Symposia Proceedings, Heteroepitaxy-on-Silicon-II, 7380.Google Scholar
33) Suhir, E. (1988) “An Approximate Analysis of Stresses in Multilayered Elastic Thin Films”, ASME J. Appl. Mech., vol. 55, 143148.Google Scholar
34) Luryi, S. and Suhir, E. (1986) “A New Approach to the High-Quality Epitaxial Growth of Lattice-Mismatched Materials”, Applied Physics Letters, 49(3), 140142.Google Scholar
35) Suhir, E. (1990) “Predicted Mechanical Behavior of High - T, Superconducting Ceramic Films”, Symp. on Microelectronic Intergrated Processing, Oct. 1989, Santa Clara, Calif., SPIE, vol. 1187, 227246.Google Scholar
36) Suhir, E. (1991) “Approximate Evaluation of the Elastic Interfacial Stresses in Thin Films with Application to High-Tc Superconducting Ceramics”, Int. J. of Solids and Structures, vol. 27, No. 8, 10251034.Google Scholar
37) Suhir, E. (1991) “An Approximate Analysis of Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate”, ASME J. Appl. Mech., to be published.Google Scholar
38) Suhir, E. (1989) ““Automatized” Peel Testing: Calculated Stresses and Deflections in the Film”, in “Interfaces Between Polymers, Metals and Ceramics,” Materials Research Society Symposia Proceedings, vol. 154,305310.Google Scholar
39) Timoshenko, S. P. and Winowski-Krieger, S. (1959) “Theory of Plates and Shells”, McGraw Hill, New York.Google Scholar
40) Balde, J. W. (1984) “Problems in the Shift to Leaded Chip Carrier Construction - An Overview”, 4-th Annual Intern. Electronic Packaging Society Conference Proceedings.Google Scholar
41) Engelmaier, W. (1985) “IEEE Compliant Lead Task Force-Phase I”, 5-th Annual Intern. Electronic Packaging Society Conference Proceedings.Google Scholar
42) Kotlowitz, R. W. and Engelmaier, W. (1986) “Impact of Lead Compliance on the Solder Attachment Reliability of Leaded Surface Mounted Devices”, 6-th Annual Intern. Electronic Packaging Society Conference Proceedings.Google Scholar
43) Marinis, T. F. et al. (1984) “Impact of External Lead Design on the Fracture of HIC-PWB Assemblies Subjected to Bending”, 34-th Electronic Component Conference, 281293.Google Scholar
44) Suhir, E. (1988) “Could Compliant External Leads Reduce the Strength of a Surface Mounted Device?”, 38-th Electronic Component Conference, 16.Google Scholar
45) Suhir, E. (1988) “On a Paradoxical Phenomenon Related to Beams on Elastic Foundation”, ASME J. Appl. Mech., vol. 55, 143148.Google Scholar
46) Lau, J. H., Rice, D. W. and Harkins, G. (1989) “Thermal Stress Analysis of TAB Packages and Interconnections”, 39-th Electronic Component Conference, 456463.Google Scholar
47) Robert, M. P. (1987) “Mechanical Modeling Problems Associated with Microelectronic Components”, Ph.D. Dissertation, Northwestern Univ., Evanston, Illinois.Google Scholar
48) Suhir, E. (1989) “Axisymmetric Elastic Deformations of a Finite Circular Cylinder with Application to Low Temperature Strains and Stresses in Solder Joints”. ASME J. Appl. Mech., vol. 56, 328333.Google Scholar
49) Suhir, E. (1989) “Twist-off Testing of Solder Joint Interconnections”, ASME J. Elect. Pack., vol. 111, No. 3, 165171.Google Scholar
50) Suhir, E. (1989) “Can Power Cycling Life of Solder Joint Interconnections be Assessed on the Basis of Temperature Cycling Tests?”, ASME J. Electron. Pack., vol. 111, No. 4, 310312.Google Scholar
51) Suhir, E. (1991) “Dynamic Response of Flexible PCBs, Experiencing Shock Loads Applied to Their Support Contours”, 41-st Electr. Comp. Conf., to be published.Google Scholar
52) Gardner, W. B. (1975) “Microbending Loss in Optical Fibers”, Bell System Techn. Journal, vol. 54, No. 2, 457465.Google Scholar
53) Suhir, E. (1988) “Effect of Initial Curvature on Low Temperature Microbending in Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 6, No. 8, 13211327.Google Scholar
54) Katsuyama, Y. et al. (1980) “Transmission Loss of Single-Mode Fiber at Low Temperatures”, Appl. Opt., vol. 19, No. 24, 42004205.Google Scholar
55) Yabuta, T. et al. (1983) “Excess Loss of Single Mode Jacketed Optical Fiber at Low Temperature”, Appl. Opt., vol. 22, No. 15, 23562362.Google Scholar
56) Lenahan, T. A. (1985) “Thermal Buckling of Dual-Coated Fibers”, AT&T Techn. I., vol. 64, No. 7, 15651584.Google Scholar
57) Vangheluwe, D. C. L. (1984) “Exact Calculations of the Spring Constant in the Buckling of Optical Fibers”, Appl. Opt., vol. 23, No. 13,20452046.Google Scholar
58) Suhir, E. (1988) “Spring Constant in the Buckling of Dual-Coated Optical Fibers”, IEEE/OSA J. Lightwave Tech., vol. 6, No. 7, 12401244.Google Scholar
59) Suhir, E. (1988) “Calculated Stresses in Dual-Coated Optical Fibers”, Conference of the Society of Plastic Engineers, ANTEC-88, 398404.Google Scholar
60) Suhir, E. (1989) “Calculated Thermally Induced Stresses in Microelectronic and Fiber-Optic Structures”, I Pan American Congress of Applied Mechanics, Rio de Janeiro, Brazil, 613615.Google Scholar
61) Suhir, E. (1989) “Bending Performance of Clamped Optical Fibers: Stresses Due to the End Off-Set”, Appl. Opt., vol. 28, No. 3,573576.Google Scholar
62) Suhir, E. (1990) “Buffering Effect of Fiber Coating and Its Influence on the Proof-Test Load in Optical Fibers”, Appl. Opt., vol. 29, No. 18,26822685.Google Scholar
63) Suhir, E. (1990) “Mechanical Approach to the Evaluation of the Low Temperature Threshold of Added Transmission Losses in Single-Coated Optical Fibers”, IEEE/OSA J. Lightwave Techn., vol. 8, No. 6, 863868.Google Scholar
64) Suhir, E. (1990) “Stresses in a Coated Optical Fiber Stretched on a Capstan”, Applied Optics, vol. 29, No. 18, 26642666.Google Scholar
65) Suhir, E., Bubel, G. M. and Tuminaro, R. (1991) “Predicted Curvature of the Glass Fiber from the Measured Curvature of Its Coating”, IEEE/OSA J. Lightwave Techn., vol. 9, No. 6, 701708.Google Scholar
66) Steinberg, D. S. (1973) “Vibration Analysis of Electronic Equipment”, John Wiley and Sons, New York.Google Scholar
67) Wong, T. L., Stevens, K. K., and Wang, G. (1990) “Experimental Modal Analysis and Dynamic Response Prediction of PC Boards with Surface Mount Electronic Components”, Preprint, ASME Winter Annual Meeting, Dallas, TX.Google Scholar
68) Suhir, E. (1991) “Dynamic Response of a Flexible Printed Circuit Board to Repetitive Impacts Applied to Its Support Contour”, ASME J. Appl. Mech., to be published.Google Scholar
69) Suhir, E. (1991) “Nonlinear Dynamic Response of a Flexible Thin Plate to Constant Acceleration Applied to Its Support Contour”, Int. J. of Solids and Structures, to be published.Google Scholar
70) Suhir, E. (1991) “Nonlinear Dynamic Response of a Flexible Printed Circuit Board to Shock Loads Applied to Its Support Contour”, 41-th Electr. Comp. and Techn. Conf., 388399.Google Scholar