Hostname: page-component-8448b6f56d-sxzjt Total loading time: 0 Render date: 2024-04-19T02:51:50.295Z Has data issue: false hasContentIssue false

Characterization of Mechanical Deformation of Nanoscale Volumes

Published online by Cambridge University Press:  11 February 2011

Christopher R. Perrey
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Ave. S.E., Minneapolis, MN 55455
William M. Mook
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Ave. S.E., Minneapolis, MN 55455
C. Barry Carter*
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Ave. S.E., Minneapolis, MN 55455
William W. Gerberich
Affiliation:
Department of Chemical Engineering and Materials Science, University of Minnesota, 421 Washington Ave. S.E., Minneapolis, MN 55455
*
* corresponding author: carter@cems.umn.edu
Get access

Abstract

The mechanical properties of nanoscale volumes and their associated defect structure are key to many future applications in nanoengineered products. In this study, techniques of mechanical testing and microscopy have been applied to better understand the mechanical behavior of nanoscale volumes. Nanoindentation has been used to investigate important mechanical material parameters such as the elastic modulus and hardness for single nanoparticles. New sample preparation methods must be developed to allow the necessary TEM characterization of the inherent and induced defect structure of these nanoparticles. Issues of chemical homogeneity, crystallinity, and defect characteristics at the nanoscale are being addressed in this study. This integration of investigative methods will lead to a greater understanding of the mechanical behavior of nanostructured materials and insights into the nature of defects in materials at the nanoscale.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. LaVan, D.A. and Buchheit, T.E.. Conference on MEMS Reliability for Critical and Space Applications - SPIE 1999;3880: 4044.Google Scholar
2. Tanner, D.M., Smith, N.F., Irwin, L.W., Eaton, W.P., Helgesen, K.S., Clement, J.J., Miller, W.M., Walraven, J.A., Peterson, K.A., Tangyunyong, P., Dugger, M.T. and Miller, S.L.. (January 2000), Sandia National Laboratory.Google Scholar
3. Yamakov, V., Wolf, D., Salazar, M., Phillpot, S.R. and Gleiter, H.. Acta Materialia 2001;49: 27132722.Google Scholar
4. Kim, J.J., Choi, Y., Suresh, S. and Argon, A.S.. Science 2002;295: 654.Google Scholar
5. Baker, S.P., Vinci, R.P. and Arias, T.. MRS Bulletin 2002;27: 26.Google Scholar
6. Veprek, S. and Argon, A.S.. Surfaces and Coatings Technology 2001;146–147: 175182.Google Scholar
7. Nix, W.D. and Gao, H.. Journal of the Mechanics and Physics of Solids 1998;46: 411425.Google Scholar
8. Horstemeyer, M.F., Baskes, M.I. and Plimpton, S.J.. Acta Materialia 2001;49: 4363.Google Scholar
9. Gerberich, W.W., Tymiak, N.I., Grunlan, J.C., Horstemeyer, M.F. and Baskes, M.I.. Journal of Applied Mechanics 2002;69: 433442.Google Scholar
10. Rao, N., Michael, B., Hansen, D., Fandrey, C., Bench, M., Girshick, S., Heberlein, J. and McMurry, P.. Journal of Materials Research 1995;10: 2073.Google Scholar
11. Rao, N.P., Tymiak, N., Blum, J., Neuman, A., Lee, H.J., Girshick, S.L., McMurry, P.H. and Heberlein, J.. Journal of Aerosol Science 1998;29: 707.Google Scholar
12. Tymiak, N., Iordanoglou, D.I., Neumann, D., Gidwani, A., Fonzo, F.D., Fan, M.H., Rao, N.P., Gerberich, W.W., McMurry, P.H., Heberlein, J.V.R. and Girshick, S.L.. (1999) in 14th International Symposium on Plasma Chemistry (Hrabovsky, M., Konrad, M. and Kopecky, V., eds.), Vol. 4, pp. 1989, Institute of Plasma Physics, Academy of Sciences of the Czech Republic, Prague.Google Scholar
13. Liu, P., Ziemann, P.J., Kittleson, D.B. and McMurry, P.H.. Aerosol Science and Technology 1995;22: 293.Google Scholar
14. Fonzo, F.D., Gidwani, A., Fan, M.H., Neumann, D., Iordanoglou, D.I., Heberlein, J.V.R., McMurry, P.H., Girshick, S.L., Tymiak, N., Gerberich, W.W. and Rao, N.P.. Applied Physics Letters 2000;77: 910912.Google Scholar
15. Gerberich, W.W., Mook, W.M., Perrey, C.R., Carter, C.B., Baskes, M.I., Mukherjee, R., Gidwani, A., Heberlein, J.V.R., McMurry, P.H. and Girshick, S.L.. Journal of the Mechanics and Physics of Solids (in press).Google Scholar