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Synthesis and processing of nanocrystalline Ag–Fe–Ni for low thermal expansion–high conductivity thermal management applications

Published online by Cambridge University Press:  31 January 2011

J. Stolk
Affiliation:
Chemical Engineering Department, Bucknell University, Lewisburg, Pennsylvania 17837
M. Gross
Affiliation:
Chemical Engineering Department, Bucknell University, Lewisburg, Pennsylvania 17837
D. Stolk
Affiliation:
Metallurgical Engineering Services, Inc., 845 East Arapaho Road, Richardson, Texas 75081
A. Manthiram
Affiliation:
Texas Materials Institute, ETC 9.104, The University of Texas at Austin, Austin, Texas 78712
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Abstract

Nanocrystalline Ag–Fe–Ni powders were produced by a reduction of the aqueous metal ion solutions with sodium borohydride and then converted to fine-grained silver–Invar alloys that offer attractive thermal, electrical, and mechanical properties. The samples were characterized by x-ray diffraction, scanning electron microscopy, wavelength dispersive x-ray spectrometry, thermomechanical analysis, microhardness measurements, and electrical conductivity measurements; thermal conductivity was estimated using the Wiedemann–Franz law. Sintering of a specimen with a nominal composition of 60 wt% Ag–25.6 wt% Fe–14.4 wt.% Ni led to the formation of a two-phase silver–Invar alloy with a grain size of approximately 2 μm, a hardness of 133 HK200g, coefficient of thermal expansion of 12.44 × 10−6 / °C, and electrical conductivity of 2.13 × 105 (Ω cm) −1.

Type
Rapid Communications
Copyright
Copyright © Materials Research Society 2001

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References

REFERENCES

1.Johannes, W.R. and Johnson, W., Int. J. Microcircuits Elec. Packaging, 17 (2), 135 (1994).Google Scholar
2. Texas Instruments, Metallurgical Materials Division, Microwave Journal, 38 (2), 124 (1995).Google Scholar
3.Jech, D.E. and Sepulveda, J.L., Intl. Symp. on Microelectronics, Las Vegas, NV, SPIE Proceedings Series 3235, 90 (1997).Google Scholar
4.Yih, P. and Chung, D.D.L., J. Mater. Sci. 32, 2873 (1997).CrossRefGoogle Scholar
5.Zweben, C., JOM 50 (6), 47 (1998).CrossRefGoogle Scholar
6.Kumar, R., Stiglich, J.J., Sudarshan, T.S., and Yu, C.C., Materials and Manufacturing Processes 11, (Marcel Dekker, New York, 1996), p. 1029.Google Scholar
7.Yamagata, S., Imamura, M., Hirose, Y., Abe, Y., Takano, Y., and Fukui, A., Int. Sym. on Microelectronics, San Diego, CA, SPIE Proc. Series 3582, 675 (1998).Google Scholar
8.Cottle, R.D., Chen, X., Jain, R.K., Eliezer, Z., Rabenberg, L., and Fine, M.E., JOM 50 (6), 67 (1998).CrossRefGoogle Scholar
9.Stolk, J. and Manthiram, A., Mater. Sci. Eng. 60, 112 (1999).CrossRefGoogle Scholar
10. ASTM B 742–90 (Reapproved 1995) Standard Specification for Fine Silver Electrical Contact Fabricated Material, Standard 3.04, Annual Book of ASTM Standards (American Society for Testing and Materials, West Conshohocken, PA, 1998), p. 440.Google Scholar
11. ASTM F 1684–96 Standard Specification forIron-Nickel and Iron-Nickel-Cobalt Alloys for Low Thermal Expansion Applications, Standard 10.04, Annual Book of ASTM Standards (American Society for Testing and Materials, West Conshohocken, PA, 1998), p. 392.Google Scholar
12.Metals Handbook, 9th ed., edited by Wenschhof, D. (American Society for Metals, Metals Park, OH, 1980), Vol. 3, p. 792.Google Scholar