MRS Proceedings
- MRS Proceedings 2008 1112 : 1112-E02-01 (12 pages)
- Copyright © Materials Research Society 2009
- DOI: http://dx.doi.org/10.1557/PROC-1112-E02-01 (About DOI)
- Published online by Cambridge University Press: 2011
Articles
3D Integration Using Adhesive, Metal, and Metal/Adhesive as Wafer Bonding Interfaces
2008 MRS Fall Meeting.
Jian-Qiang Lua1, J. Jay McMahona2 and Ronald J. Gutmanna3
a1 luj@rpi.edu, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
a2 j.jay.mcmahon@gmail.com, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
a3 gutmar@rpi.edu, Rensselaer Polytechnic Institute, Department of Electrical, Computer, and Systems Engineering; Center for Integrated Electronics, Troy, New York, United States
Abstract
Three-dimensional (3D) integration is an emerging technology that vertically stacks and interconnects multiple materials, technologies and functional components to form highly integrated micro/nano-systems. This paper reviews the materials and technologies for three wafer bonding approaches to 3D integration using adhesive, metal, and metal/adhesive as the bonding interfaces. Similarities and differences in architectural advantages and technology challenges are presented, with recent research advances discussed.
(Received January 11 2009)
(Accepted January 30 2009)
Key Words
- bonding;
- electronic material;
- microelectronics
