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In-situ TEM investigation of deformation behavior of metallic glass pillars

Published online by Cambridge University Press:  31 January 2011

Changqiang Chen
Affiliation:
c.chen@rug.nlcqchen01@gmail.com, University of Groningen, Applied Physics, Groningen, Netherlands
Yutao Pei
Affiliation:
y.pei@rug.nl, University of Groningen, Applied Physics, Groningen, Netherlands
Jeff De Hosson
Affiliation:
j.t.m.de.hosson@rug.nl, University of Groningen, Applied Physics, Groningen, Netherlands
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Abstract

We show results of in situ TEM (Transmission electron microscope) quantitative investigations on the compression behaviors of amorphous micropillars fabricated by focused ion beam from Cu47Ti33Zr11Ni6Sn2Si1 metallic glass (MG) ribbon. Pillars with well defined gauge sections and tip diameter ranging from 100 nm to 640 nm are studied. Quantitative compression tests were performed by a recently developed Picoindenter TEM holder, with the evolution of individual shear bands monitored in real time in TEM. It is found that the deformation of the MG pillars at the present size domain is still dominated by discrete shear banding as demonstrated by intermittent events in the load-displacement curves. However, the frequency, amplitude and distribution of these shear banding events are clearly size dependent at submicrometer scale, leading to an apparently transition in deformation mode from highly localized inhomogeneous deformation to less localized and more distributed deformation with decreasing pillars diameter. Deformation of a 105 nm diameter pillar having rounded tips is characterized with fully homogeneous bulge at the initial stage of deformation, indicating prompting effect of multi-axial stress state on transition to fully homogeneous deformation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

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References

1. Greer, AL. Science 1995; 267:1947.10.1126/science.267.5206.1947Google Scholar
2. Inoue, A. Acta Mater 2000:48:279.10.1016/S1359-6454(99)00300-6Google Scholar
3. Schuh, CA, Hufnagel, TC, Ramamurty, U. Acta Mater 2007;55:4067.10.1016/j.actamat.2007.01.052Google Scholar
4. Guo, H., Yan, P. F., Wang, Y. B., Tan, J., Zhang, Z. F., Sui, M. L., E. MA. Nat. Mater. 6, 735 (2007).10.1038/nmat1984Google Scholar
5. Zheng, Q., Cheng, S., Strader, J. H., Ma, E. and Xu, J., Scr. Mater. 56, 161 (2007).10.1016/j.scriptamat.2006.09.023Google Scholar
6. Lee, C. J., Huang, J. C., Nieh, T. G.. Appl. Phys. Lett. 91, 161913 (2007)10.1063/1.2800313Google Scholar
7. Cheng, S., Wang, X L, Liaw, P. K.. Appl. phys. Lett. 91, 201917 (2007)10.1063/1.2813623Google Scholar
8. Schuster, B. E., Wei, Q., Ervin, M.H., Hruszkewycz, S. Q. , Miller, M. K., Hufnagel, T.C., Ramesh, K. T.. Scr. Mater. 57, 517 (2007)10.1016/j.scriptamat.2007.05.025Google Scholar
9. Shan, Z. W., Li, J., Cheng, Y. Q., Minor, A. M., Syed, S. A. Asif, Warren, O. L., and Ma, E.. Phys. Rev. B 77, 155419 (2008)10.1103/PhysRevB.77.155419Google Scholar
10. Lai, Y. H., Lee, C. J., Cheng, Y. T., Chou, H. S., Chen, H. M., Du, X. H., Chang, C. I., Huang, J. C., Jain, S. R., Jang, J. S. C., Nieh, T. G.. Scr. Mater, 58, 890, (2008).10.1016/j.scriptamat.2008.01.009Google Scholar
11. Volkert, C. A., Donohue, A., and Spaepen, F.. J Appl Phys. 103, 083539 (2008).10.1063/1.2884584Google Scholar
12. Hays, C. C., Kim, C. P., W. L. Johnson. Phys. Rev. Lett. 84, 2901 (2000).10.1103/PhysRevLett.84.2901Google Scholar
13. Wang, Y. M., Li, J., Hamza, A. V., and Barbee, T. W., Jr. Proc. Natl. Acad. Sci. 104, 11155 (2007).10.1073/pnas.0702344104Google Scholar
14. RD, Conner, WL, Johnson, NE, Paton, WD, Nix. J Appl Phys 2003;94:904.Google Scholar
15. Ravichandran, G, Molinari, A. Acta Mater 2005;53:4087.10.1016/j.actamat.2005.05.011Google Scholar