Journal of Materials Research

Articles

Stress corrosion of organosilicate glass films in aqueous environments: Role of pH

F. Iacopia1 c1, C. Eliaa2, T. Fourniera3, F. Sinapia4 and Y. Travalya4

a1 Inter-university Micro-Electronics Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium

a2 Inter-university Micro-Electronics Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium; and Istituto Universitario degli Studi Superiori di Pavia, Pavia, Italy

a3 Inter-university Micro-Electronics Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium; and Génie des Matériaux, Université Aix-Marseille III, Marseille, France

a4 Inter-university Micro-Electronics Center (IMEC), Kapeldreef 75, B-3001 Leuven, Belgium

Abstract

Subcritical cracking of thin glass films caused by stress-corrosion phenomena cannot be neglected when it comes to application and manufacturing processes that involve exposure to aqueous environments. A protocol is introduced to allow for a quantitative study of stress corrosion through channel cracking experiments. By this method, an exponential dependence of the crack propagation rate on the pH of the aqueous environment is revealed. Therefore, this behavior should be accounted for through the use of an appropriate pre-exponential factor in the expression of channel cracking rate. This factor should reflect the reduced crack resistance of the glass film caused by the weakening of the silica bonds behind the crack tip in the aqueous environment. A direct comparison between commercial slurries and reference solutions confirms that the crack resistance is a function of the pH of the ambient.

(Received May 27 2007)

(Accepted January 02 2008)

Key Words:

  • Thin film;
  • Fracture;
  • Amorphous

Correspondence:

c1 Address all correspondence to this author. e-mail: francesca.iacopi@imec.be

0Comments
Related Content