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Highly Conductive Polymer Nanocomposite – Application in Interconnects and Traces

Published online by Cambridge University Press:  28 December 2015

Chenggang Chen*
Affiliation:
Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright Patterson Air Force Base, OH 45431, U.S.A. University of Dayton Research Institute, Dayton, OH 45469, U.S.A.
Sabyasachi Ganguli
Affiliation:
Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright Patterson Air Force Base, OH 45431, U.S.A.
Ajit K. Roy
Affiliation:
Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright Patterson Air Force Base, OH 45431, U.S.A.
Jason Foley
Affiliation:
Munitions Directorate, Air force Research Laboratory, Eglin Air Force Base, FL, 32542 U.S.A.
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Abstract

Commercial off-the-shelf (COTS) electronics are generally not specifically designed to perform in extremely transient high impact scenarios. This research focused on the development of a silver-decorated carbon black-based polymeric nanocomposite with properties such as high conductivity, flexibility, and shock absorbency. Polymeric rubber materials are generally very flexible and shock absorbing, however, most polymeric materials are electrical insulators. The dispersion of the silver-decorated carbon black into the polymeric matrix could significantly improve the electrical conductivity. The processing and fabrication of Ag-CB (silver-carbon black)/Epoxy (thermosetting epoxy polymer) and Ag-CB/TPU (thermoplastic polyurethane) will be reported. Both Ag-CB/Epoxy and Ag-CB/TPU mixtures with solvents showed the shear-thinning behavior, which was an important characteristic for direct printing of traces and Additive Manufacturing (AM). The mechanical properties of the nanocomposites were measured using Dynamic Mechanical Analysis (DMA) over a wide range of temperatures. These nanocomposite materials were also successfully used to print flexible circuits using a 3D-printing machine. The electrical resistance change for the Ag-CB/Epoxy on polydimethylsiloxane (PDMS) and Ag-CB/TPU on PDMS under strain was studied, and the results will be discussed.

Type
Articles
Copyright
Copyright © Materials Research Society 2015 

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References

REFERENCES

Custer, W., IPC Outlook (www.ipc.org) (access on August 15, 2014).Google Scholar
Yao, S. and Zhu, Y., Adv. Mater. 27, 14801511 (2015).Google Scholar
Vaia, R. A. and Giannelis, E. P., MRS Bull. 26, 394 (2001).CrossRefGoogle Scholar
Luo, X. and Chung, D.D.L., J. Mater. Sci. 34, 273276 (1999).Google Scholar
Tra-Con, Tra-Duct 2902, www.tra-con.com(access on January, 12, 2015).Google Scholar
EPO-TEK® H20E, www.epotek.com (access on September, 25, 2014).Google Scholar