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Giant pop-ins in nanoindented silicon and germanium caused by lateral cracking

Published online by Cambridge University Press:  31 January 2011

D.J. Oliver*
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, The Australian National University, Canberra ACT 0200, Australia
B.R. Lawn
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
R.F. Cook
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
M.G. Reitsma
Affiliation:
Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, Maryland 20899
J.E. Bradby
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, The Australian National University, Canberra ACT 0200, Australia
J.S. Williams
Affiliation:
Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, The Australian National University, Canberra ACT 0200, Australia
P. Munroe
Affiliation:
Electron Microscope Unit, University of New South Wales, Sydney, NSW 2052, Australia
*
a) Address all correspondence to this author. e-mail: djo109@rsphysse.anu.edu.au
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Abstract

Giant “pop-in” displacements are observed in crystalline silicon and germanium during high-load nanoindentation with a spherical diamond tip. These events are consistent with material removal triggered by lateral cracking during loading, which poses a hazard to microelectromechanical systems (MEMS) operation. We examine the scaling of the pop-in displacements as a function of peak indentation load and demonstrate a correlation with the depth of the plastic contact zone. We argue that giant pop-ins may occur in a broad range of highly brittle materials.

Keywords

Type
Materials Communications
Copyright
Copyright © Materials Research Society 2007

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References

REFERENCES

1Hainsworth, S.V., Whithead, A.J.Page, T.F.: The nanoindentation response of silicon and related structurally similar materials in Plastic Deformation of Ceramics, edited by R.C. Bradt, C.A. Brookes, and J.L. Routbort (Plenum: New York) 1995 173CrossRefGoogle Scholar
2Lawn, B.R., Hockey, B.J.Wiederhorn, S.M.: Atomically sharp cracks in brittle solids: An electron microscopy study. J. Mater. Sci. 15(5), 1207 1980CrossRefGoogle Scholar
3Clarke, D.R., Kroll, M.C., Kirchner, P.D., Cook, R.F.Hockey, B.J.: Amorphization and conductivity of silicon and germanium induced by indentation. Phys. Rev. Lett. 60(21), 2156 1988CrossRefGoogle ScholarPubMed
4Bradby, J.E., Williams, J.S., Wong-Leung, J., Swain, M.V.Munroe, P.: Transmission electron microscopy observation of deformation microstructure under spherical indentation in silicon. Appl. Phys. Lett. 77(23), 3749 2000CrossRefGoogle Scholar
5Bradby, J.E., Williams, J.S., Wong-Leung, J., Swain, M.V.Munroe, P.: Nanoindentation-induced deformation of Ge. Appl. Phys. Lett. 80(15), 2651 2002CrossRefGoogle Scholar
6Oliver, D.J., Bradby, J.E., Williams, J.S., Swain, M.V.Munroe, P.: Giant pop-ins and amorphization in germanium during indentation. J. Appl. Phys. 101(4), 043524 2007CrossRefGoogle Scholar
7Samuels, L.E.Mulhearn, T.O.: An experimental investigation of the deformed zone associated with indentation hardness impressions. J. Mech. Phys. Solids 5(2), 125 1957CrossRefGoogle Scholar
8Lawn, B.R.Evans, A.G.: A model for crack initiation in elastic/plastic indentation fields. J. Mater. Sci. 12(11), 2195 1977CrossRefGoogle Scholar
9Hagan, J.T.: Micromechanics of crack nucleation during indentations. J. Mater. Sci. 14(12), 2975 1979CrossRefGoogle Scholar
10Lawn, B.R.Marshall, D.B.: Hardness, toughness, and brittleness: An indentation analysis. J. Am. Ceram. Soc. 62(7–8), 347 1979CrossRefGoogle Scholar
11Cook, R.F.: Strength and sharp contact fracture of silicon. J. Mater. Sci. 41(3), 841 2006CrossRefGoogle Scholar
12Lorenz, D., Zeckzer, A., Hilpert, U., Grau, P., Johansen, H.Leipner, H.S.: Pop-in effect as homogeneous nucleation of dislocations during nanoindentation. Phys. Rev. B 67(17), 172101 2004CrossRefGoogle Scholar
13Weppelmann, E.R., Field, J.S.Swain, M.V.: Observation, analysis, and simulation of the hysteresis of silicon using ultra-micro-indentation with spherical indenters. J. Mater. Res. 8(4), 830 1993CrossRefGoogle Scholar
14Field, J.S., Swain, M.V.Dukino, R.D.: Determination of fracture toughness from the extra penetration produced by indentation-induced pop-in. J. Mater. Res. 18(6), 1412 2003CrossRefGoogle Scholar
15Marshall, D.B., Lawn, B.R.Evans, A.G.: Elastic plastic indentation damage in ceramics–the lateral crack system. J. Am. Ceram. Soc. 65(11), 561 1982CrossRefGoogle Scholar
16Tanner, D.M., Walraven, J.A., Helgesen, K.S., Irwin, L.W., Brown, F., Smith, N.F.Masters, N.: MEMS reliability in a shock environment in Proceedings of the 38th Annual IEEE International Reliability Physics Symposium,2000, 129–138Google Scholar
17Walraven, J.A.: Failure mechanisms in MEMS in Test Conference, 2003. Proceedings of the International Test Conference (ITC) 2003, Vol. 1, pp. 828–833Google Scholar
18Tan, T.F., Weber, K.Dharan, C.K.H.: Failure analysis of thermal actuators, comb drives, and other microelectromechanical elements. J. Failure Anal. Prevent. 7, 137 2007CrossRefGoogle Scholar
19Swain, M.V.Wittling, M.: Comparison of acoustic emission from pointed and spherical indentation of TiN films on silicon and sapphire. Surf. Coat. Technol. 76–77, 528 1995CrossRefGoogle Scholar
20Hainsworth, S.V., McGurk, M.R.Page, T.F.: The effect of coating cracking on the indentation response of thin hard-coated systems. Surf. Coat. Technol. 102(1–2), 97 1998CrossRefGoogle Scholar
21Berasategui, E.G.Page, T.F.: The contact response of thin SiC-coated silicon systems—Characterisation by nanoindentation. Surf. Coat. Technol. 163–164, 491 2003CrossRefGoogle Scholar
22Rabe, R., Breguet, J.M., Schwaller, P., Stauss, S., Haug, F.J., Patscheider, J.Michler, J.: Observation of fracture and plastic deformation during indentation and scratching inside the scanning electron microscope. Thin Solid Films 469–470, 206 2004CrossRefGoogle Scholar
23Cook, R.F.Pharr, G.M.: Direct observation and analysis of indentation cracking in glasses and ceramics. J. Am. Ceram. Soc. 73(4), 787 1990CrossRefGoogle Scholar
24Arora, A., Marshall, D.B., Lawn, B.R.Swain, M.V.: Indentation deformation/fracture of normal and anomalous glasses. J. Non-Cryst. Solids 31(3), 415 1979CrossRefGoogle Scholar
25Oliver, D.J., Bradby, J.E., Williams, J.S., Swain, M.V., McGrouther, D.Munroe, P.: Indentation-induced damage mechanisms in germanium in Focused Ion Beams for Analysis and Processing, edited by W. MoberlyChan, H. Colijn, R. Langford, and A. Marshall (Mater. Res. Soc. Symp. Proc.) 983E Warrendale, PA, 2007 0983-LL08-02CrossRefGoogle Scholar
26Lepienski, C.M., Michel, M.D., Araujo, P.J.G.Achete, C.A.: Indentation fracture of a-C:H thin films from chemical vapour deposition. Philos. Mag. 86(33–35), 5397 2006CrossRefGoogle Scholar