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Residual stress analysis with stress-dependent growth rate and creep deformation during oxidation

Published online by Cambridge University Press:  22 July 2016

Yaohong Suo Open the ORCID record for Yaohong Suo [Opens in a new window] ,
Zhonghua Zhang  and
Xiaoxiang Yang
Yaohong Suo*
Affiliation:
School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China; and School of Science, Xi'an University of Science and Technology, Xi'an 710054, China
Zhonghua Zhang*
Affiliation:
School of Science, Xi'an University of Science and Technology, Xi'an 710054, China
Xiaoxiang Yang
Affiliation:
School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China
*
a) Address all correspondence to this author. e-mail: yaohongsuo@126.com
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Abstract

In this paper, taking into account the external loading, growth strain, creep, and bending deformation during the metallic high-temperature oxidation, a residual stress evolution model is developed according to the force- and moment-equilibrium equations. In this model, oxidation kinetic relationship (the stress-dependent growth rate) is related to the stress in the oxide scale, not classical parabolic law. If and only if the stress in the scale or the activation volume is equal to zero, this relationship can reduce to the parabolic law. Then the stress-dependent oxidation kinetics is compared with the stress-independent one (the parabolic law). Finally, effects of the external loading on the stress distribution in the oxide scale, the curvature of the system and the scale thickness are discussed, and numerical results show that the tensile external loading decreases the oxidation stress and promotes the growth rate of the oxidation layer.

Keywords

high temperature oxidationresidual stressstress-dependent growth ratecreep deformationexternal loading
Type
Articles
Information
Journal of Materials Research , Volume 31 , Issue 16 , 29 August 2016 , pp. 2384 - 2391
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Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Stephen, L.C.: Mechanochemistry: A tour of force. Nature 487, 176–177 (2012).Google Scholar
Saillard, A., Cherkaoui, M., and EI Kadiri, H.: Stress-induced roughness development during oxide scale growth on a metallic alloy for SOFC interconnects. Modell. Simul. Mater. Sci. Eng. 19, 015009 (2011).CrossRefGoogle Scholar
Clarke, D.R.: The lateral growth strain accompanying the formation of a thermally grown oxide. Acta Mater. 51(4), 1393–1407 (2003).CrossRefGoogle Scholar
Evans, H.E.: Stress effects in high temperature oxidation of metals. Int. Mater. Rev. 40, 1–40 (1995).CrossRefGoogle Scholar
Reddy, A., Hovis, D.B., Heuer, A.H., Paulikas, A.P., and Veal, B.W.: In situ study of oxidation-induced growth strains in a model NiCrAlY bond-coat alloy. Oxid. Met. 67(3–4), 153–177 (2007).CrossRefGoogle Scholar
Hu, L., Hovis, D.B., and Heuer, A.H.: Transient oxidation of a γ–Ni–28Cr–11Al alloy. Oxid. Met. 73(1–2), 275–288 (2010).CrossRefGoogle Scholar
Freund, L.B. and Nix, W.D.: A critical thickness condition for a strained compliant substrate/epitaxial film system. Appl. Phys. Lett. 69, 173–175 (1996).CrossRefGoogle Scholar
Zhang, T.Y., Lee, S., Guido, L.J., and Hsueh, C.H.: Criteria for formation of interface dislocations in a finite thickness epilayer deposited on a substrate. J. Appl. Phys. 85(10), 7579–7586 (1999).CrossRefGoogle Scholar
Panicaud, B., Grosseau-Poussard, J.L., and Dinhut, J.F.: General approach on the growth strain versus viscoplastic relaxation during oxidation of metals. Comput. Mater. Sci. 42(2), 286–294 (2008).CrossRefGoogle Scholar
Maharjan, S., Zhang, X.C., and Wang, Z.D.: Effect of oxide growth strain in residual stresses for the deflection test of single surface oxidation of alloys. Oxid. Met. 77(1–2), 93–106 (2012).CrossRefGoogle Scholar
Clarke, D.R.: The lateral growth strain accompanying the formation of a thermally grown oxide. Acta Mater. 51(4), 1393–1407 (2003).CrossRefGoogle Scholar
Evans, A.G. and Hutchinson, J.W.: The thermomechanical integrity of thin films and multilayers. Acta Metall. Mater. 43(7), 2507–2530 (1995).CrossRefGoogle Scholar
Hsueh, C.H. and Evans, A.G.: Residual stresses and cracking in metal/ceramic systems for microelectronics packaging. J. Am. Ceram. Soc. 68(3), 120–127 (1985).CrossRefGoogle Scholar
Hu, S.M.: Stress-related problems in silicon technology. J. Appl. Phys. 70(6), R53–R80 (1991).CrossRefGoogle Scholar
Volkert, C.A.: Density changes and viscous flow during structural relaxation of amorphous silicon. J. Appl. Phys. 74(12), 7107–7113 (1993).CrossRefGoogle Scholar
Grosseau-Poussard, J.L., Panicaud, B., and Ben Afia, S.: Modelling of stresses evolution in growing thermal oxides on metals. A methodology to identify the corresponding mechanical parameters. Comp. Mater. Sci. 71(7), 47–55 (2013).CrossRefGoogle Scholar
Bull, S.J.: Modeling of residual stress in oxide scales. Oxid. Met. 49(1–2), 1–17 (1998).CrossRefGoogle Scholar
Wang, D.Y., Wu, X.D., Wang, Z.X., and Chen, L.Q.: Cracking causing cyclic instability of LiFePO4 cathode material. J. Power Sources 140(1), 125–128 (2005).CrossRefGoogle Scholar
Limarga, A.M. and Wilkinson, D.S.: Modeling the interaction between creep deformation and scale growth process. Acta Mater. 55(1), 189–201 (2007).CrossRefGoogle Scholar
Limarga, A.M. and Wilkinson, D.S.: Creep-driven nitride scale growth in γ-TiAl. Acta Mater. 55(1), 25–260 (2007).CrossRefGoogle Scholar
Zhou, H.G., Qu, J.M., and Cherkaoui, M.: Stress-oxidation interaction in selective oxidation of Cr–Fe alloys. Mech. Mater. 42(1), 63–71 (2010).CrossRefGoogle Scholar
Wang, H.L., Suo, Y.H., and Shen, S.P.: Reaction-diffusion-stress coupling effect in inelastic oxide scale during oxidation. Oxid. Met. 83, 507–519 (2015).CrossRefGoogle Scholar
Suo, Y.H. and Shen, S.P.: Coupling diffusion-reaction-mechanics model for oxidation. Acta Mech. 226(10), 3375–3386 (2015).CrossRefGoogle Scholar
Panicaud, B., Grosseau-Poussard, J.L., and Dinhut, J.F.: General approach on the growth strain versus viscoplastic relaxation during oxidation of metals. Comput. Mater. Sci. 42(2), 286–294 (2006).CrossRefGoogle Scholar
Maharjan, S., Zhang, X.C., Xuan, F.Z., Wang, Z.D., and Tu, S.T.: Residual stresses within oxide layers due to lateral growth strain and creep strain: Analytical modeling. J. Appl. Phys. 110, 063511(8 pages) (2011).CrossRefGoogle Scholar
Ruan, J.L., Pei, Y.M., and Fang, D.N.: Residual stress analysis in the oxide scale/metal substrate system due to oxidation growth strain and creep deformation. Acta Mech. 223, 2597–2607 (2012).CrossRefGoogle Scholar
Ruan, J.L., Pei, Y.M., and Fang, D.N.: On the elastic and creep stress analysis modeling in the oxide scale/metal substrate system due to oxidation growth strain. Corros. Sci. 66, 315–323 (2013).CrossRefGoogle Scholar
Hu, S.L. and Shen, S.P.: Non-equilibrium thermodynamics and variational principles for fully coupled thermal–mechanical–chemical processes. Acta Mech. 224, 2895–2910 (2013).CrossRefGoogle Scholar
Suo, Y.H. and Shen, S.P.: General approach on chemistry and stress coupling effects during oxidation. J. Appl. Phys. 114, 164905(6 pages) (2013).CrossRefGoogle Scholar
Suo, Y.H. and Shen, S.P.: Residual stress analysis due to chemomechanical coupled effect, intrinsic strain and creep deformation during oxidation. Oxid. Met. 84(3–4), 413–427 (2015).CrossRefGoogle Scholar
Zhang, Y., Zhang, X.C., Tu, S.T., and Xuan, F.Z.: Analytical modeling on stress assisted oxidation and its effect on creep response of metals. Oxid. Met. 82, 311–330 (2014).CrossRefGoogle Scholar
Dong, X.L., Fang, X.F., Feng, X., and Hwang, K.C.: Diffusion and stress coupling effect during oxidation at high temperature. J. Am. Ceram. Soc. 96(1), 44–46 (2013).CrossRefGoogle Scholar
Dong, X.L., Feng, X., and Hwang, K.C.: Oxidation stress evolution and relaxation of oxide film/metal substrate system. J. Appl. Phys. 112, 023502(6 page) (2012).CrossRefGoogle Scholar
Saunders, S.R.J., Evans, H.E., Li, M., Gohil, D.D., and Osgerby, S.: Oxidation growth stresses in an alumina-forming ferritic steel measured by creep deflection. Oxid. Met. 48(3–4), 189–200 (1997).CrossRefGoogle Scholar
Haftbaradaran, H., Gao, H.J., and Curtin, W.A.: A surface locking instability for atomic intercalation into a solid electrode. Appl. Phys. Lett. 96, 091909 (2010).CrossRefGoogle Scholar
Xiao, X., Liu, P., Verbrugge, M.W., Haftbaradaran, H., and Gao, H.: Improved cycling stability of silicon thin film electrodes through patterning for high energy density lithium batteries. J. Power Sources 196(3), 1409–1416 (2011).CrossRefGoogle Scholar
Hay, R.S.: Growth stress in SiO2 during oxidation of SiC fibers. J. Appl. Phys. 111(6), 063527(13 pages) (2012).CrossRefGoogle Scholar
Evans, H.E., Norfolk, D.J., and Swan, T.: Perturbation of parabolic kinetics resulting from the accumulation of stress in protective oxide layers. J. Electrochem. Soc. 125(7), 1180–1185 (1978).CrossRefGoogle Scholar
Tolpygo, V.K. and Clarke, D.R.: Wrinkling of α-alumina films grown by thermal oxidation-I. Quantitative studies on single crystals of Fe–Cr–Al alloy. Acta Mater. 46(14), 5153–5166 (1998).CrossRefGoogle Scholar
Calvarin-Amiri, G., Huntz, A.M., and Molins, R.: Effect of an applied stress on the growth kinetics of oxide scales formed on Ni–20Cr alloys. Mater. High Temp. 18, 91–99 (2001).Google Scholar
Gauthier, W., Pailler, F., Lamon, J., and Pailler, R.: Oxidation of silicon carbide fibers during static fatigue in air at intermediate temperatures. J. Am. Ceram. Soc. 92(9), 2067–2073 (2009).CrossRefGoogle Scholar