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Micromechanical Process Integration and Material Optimization for High Performance Silicon-Germanium Bolometers

Published online by Cambridge University Press:  30 July 2012

Gunnar B. Malm
Affiliation:
School of ICT
Mohammadreza Kolahdouz
Affiliation:
School of ICT
Fredrik Forsberg
Affiliation:
Microsystem Technology Lab, KTH Royal Institute of Technology, Sweden
Niclas Roxhed
Affiliation:
Microsystem Technology Lab, KTH Royal Institute of Technology, Sweden
Frank Niklaus
Affiliation:
Microsystem Technology Lab, KTH Royal Institute of Technology, Sweden
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Abstract

Semiconductor-based thermistors are very attractive sensor materials for uncooled thermal infrared (IR) bolometers. Very large scale heterogeneous integration of MEMS is an emerging technology that allows the integration of epitaxially grown, high-performance IR bolometer thermistor materials with pre-processed CMOS-based integrated circuits for the sensor read-out. Thermistor materials based on alternating silicon (Si) and silicon-germanium (SiGe) epitaxial layers have been demonstrated and their performance is continuously increasing. Compared to a single layer of silicon or SiGe, the temperature coefficient of resistance (TCR) can be strongly enhanced to about 3 %/K, by using thin alternating layers. In this paper we report on the optimization of alternating Si/SiGe layers by advanced physically based simulations, including quantum mechanical corrections. Our simulation framework provides reliable predictions for a wide range of SiGe layer compositions, including concentration gradients. Finally, our SiGe thermistor layers have been evaluated in terms of low-frequency noise performance, in order to optimize the bolometer detectivity.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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References

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