Hostname: page-component-848d4c4894-x24gv Total loading time: 0 Render date: 2024-05-20T22:36:42.128Z Has data issue: false hasContentIssue false
  • English
  • Français

Chemistry at Polyimide-Metal Interfaces: In Situ FTIR Studies of Polymer Curing Processes and Thermal Stability

Published online by Cambridge University Press:  22 February 2011

Jiong-Ping Lu ,
David Volfson ,
Fred Trusell  and
Klavs F. Jensen
Jiong-Ping Lu
Affiliation:
Electronics Packaging Program and Departments of Chemical Engineeringand, Electrical Engineering and Computer Science Massachusetts Institute of Technology Cambridge, MA 02139
David Volfson
Affiliation:
Electronics Packaging Program and Departments of Chemical Engineeringand, Electrical Engineering and Computer Science Massachusetts Institute of Technology Cambridge, MA 02139
Fred Trusell
Affiliation:
Electronics Packaging Program and Departments of Chemical Engineeringand, Electrical Engineering and Computer Science Massachusetts Institute of Technology Cambridge, MA 02139
Klavs F. Jensen
Affiliation:
Electronics Packaging Program and Departments of Chemical Engineeringand, Electrical Engineering and Computer Science Massachusetts Institute of Technology Cambridge, MA 02139
Get access

Abstract

We report in-situ Fourier transform infrared (FTIR) reflection-absorption studies of curing chemistry of polyimide thin films on Crand Cu surfaces, and of the thermal stability of the resulting thin film interfaces when exposed to air at elevated temperatures. The polyimide investigated is based on 4,4'-(hexafluoroisopropylidene)bis(phthalicanhydride)-4,4'-bis(4-aminophenoxy)-biphenyl. The imidization process takes place at temperatures higher than 90°C anda small amount of anhydride is generated during curing. This by-product is converted to imide at temperatures above 250°C. Complete imidization is achieved after curing at 300°C on Cr substrates, while evidence for incomplete curing on Cu is observed under the same conditions. Thermal stability studies with Cr and Cu substrates show that thermal decomposition of thin (∼1000Å) polyimide filmsoccurs on Cu when the film is exposed to air at 200°C, while the polyimide is stable on Cr.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 282: Symposium E – Chemical Perspectives of Microelectronic Materials III , 1992 , 581
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tummala, R.R. and Rymaszewski, E.J., ed., Microelectronics Packaging Handbook, Van Norstrand Reinhold, NY, 1989 Google Scholar
2. Jensen, R.J., in Polymers for High Technology: Electronics and Photonics, edited by Bowden, M.J. and Turner, S.R.(ed), Am. Chem. Soc, Washington D.C., 1987 Google Scholar
3. Sroog, C.E., Prog. Polym. Sci. 16, 561 (1991).Google Scholar
4. Wilson, D., Stenzenberger, H.D. and Hergenrother, P.M. (ed.), Polyimides, Blackie, Glasgow, 1990.Google Scholar
5. Koenig, J.L., Spectroscopy of Polymers, Am. Chem. Soc, Washington DC, 1992.Google Scholar
6. Roginski, R.T. and Fjare, D.E., in Electronic Packaging Materials Science VI, edited by Ho, P.S., Jackson, K.A., Li, C.Y. and Lipscomb, G.F. (Mat. Res. Soc. Symp. Proc. 264, Pittsburgh, PA, 1992).Google Scholar
7. Pryde, C. A., Soc. Plast. Eng. ANTEC 90 439 (1990).Google Scholar
8. Snyder, R.W., in Polyimides: Materials, Chemistry and Characterization, edited by Feger, C., Khojasteh, M.M. and McGrath, J.E., Elsevier, Amsterdam, 1989.Google Scholar
9. Pryde, C.A., J. Polym. Sci. Part A: Polym. Chem. 27, 711 (1989).Google Scholar
10. Colthup, N.B., Day, L.H. and Wiberley, S.E., Introduction to Infrared and Raman Spectroscopy, 3rd ed, (Academic Press, Boston, 1990).Google Scholar
11. Davis, L.E., MacDonald, N.C., Palmberg, P.W., Riach, G.E. and Weber, R.E., Handbook of Auger Electron Spectroscopy, Perkin-Elmer, Eden Prairie, MN, 2nd edn. 1978.Google Scholar
12. Jellinek, H.H.G. and Wei, Y.C., J. Polym. Sci., B24, 503 (1986).Google Scholar
13. Allara, D.L. and White, C.W., in Stabilization and Degradation of Polymers, edited by Allara, D.L. and Hawkins, W.L., Am. Chem. Soc. Washington, D.C., 1978, pp. 273.Google Scholar
14. Even, R., Palleau, J., Oberlin, J.C., Pantel, R., Laviale, D., Templier, F., Torres, J., Giustiniani, R. and Cros, A., in Polyimides and other High-Temperature Polymers, edited by Abadie, M.J.M. and Sillion, B., Elsevier, Amsterdam, 1991, pp. 407.Google Scholar
15. Shih, D.-Y., Klymko, N, Flitsch, R., Paraszczak, J. and Nunes, S., J. Vac. Sci. Tech., A9, 2963 (1991).Google Scholar