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Mechanical Behavior and Microstructure of Nanoporous Gold Films

Published online by Cambridge University Press:  01 February 2011

Ye Sun Sun
Affiliation:
yesun@engr.uky.edu, University of Kentucky, Chemical and Materials Engineering, Lexington, KY, 40506, United States
T. John Balk
Affiliation:
balk@engr.uky.edu, University of Kentucky, Chemical and Materials Engineering, Lexington, KY, 40506, United States
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Abstract

Nanoporous gold (NPG) thin films offer an opportunity to investigate the effects of nanoscale geometric confinement on the mechanical properties of metals. In the present study, NPG films supported by substrates were fabricated by dealloying Au-Ag films on Kapton and silicon. The microstructural evolution of NPG at various stages of dealloying was observed and analyzed by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Cracking occurred at grain boundaries during dealloying and is believed to result from pre-existing tensile stress in the film. Stress evolution of NPG films on silicon substrates during dealloying was measured with the wafer curvature technique and revealed an overall shift toward compressive stress.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

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