Hostname: page-component-7c8c6479df-995ml Total loading time: 0 Render date: 2024-03-28T23:45:01.090Z Has data issue: false hasContentIssue false

Three-dimensional magnetic energy harvester applied for locomotive devices

Published online by Cambridge University Press:  28 November 2011

N.-C. Tsai*
Affiliation:
Department of Mechanical Engineering, National Cheng Kung University, Tainan City 70101, Taiwan, ROC
S.-L. Hsu
Affiliation:
Department of Mechanical Engineering, National Cheng Kung University, Tainan City 70101, Taiwan, ROC
Get access

Abstract

An innovative tri-axes micro-power receiver is proposed and studied for wireless magnetic energy transmission. The tri-axes micro-power receiver mainly consists of two sets of 3D micro-solenoids and one set of planar micro-coils in which individually iron core is all embedded. The three sets of micro-coils/micro-solenoids are designed to be orthogonal to each other. Therefore, no matter which direction the input magnetic flux is present along, the supplied magnetic energy can be harvested and transformed into electric power by the proposed micro-power receiver in wireless sense. Not only dead zone of receiving power is greatly reduced, but also transformation efficiency of magnetic energy into electric power can be much enhanced. By Biot-Savart law and Faraday’s law, the mathematical description upon power transmission from transmitter to receiver is developed. By employing commercial software, Ansoft Maxwell, based on finite element method, the estimation error on power transmission by mathematical description is revealed. Besides, the preliminary simulation results by Ansoft Maxwell show that the proposed micro-power receiver can efficiently harvest the energy supplied by magnetic power source. The design parameters of tri-axes micro-receiver are hence examined and verified for follow-up fabrication. At last, for the MEMS process, the isotropic etching technique is employed to micro-machine the inverse-trapezoid fillister so that the copper wire can be successfully electroplated. The adhesion between micro-coils and fillister is hence much enhanced as well.

Type
Research Article
Copyright
© EDP Sciences 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Tsai, N.-C., Sue, C.-Y., Sens. Actuat. A 141, 670 (2008)CrossRef
Jeon, Y.B., Sood, R., Jeong, J.-H., Kim, S.-G., Sens. Actuat. A 122, 16 (2005)CrossRef
Sari, I., Balkan, T., Kulah, H., Sens. Actuat. A 145–146, 405 (2008)CrossRef
Huesgen, T., Woias, P., Kockmann, N., Sens. Actuat. A 145–146, 423 (2008)CrossRef
Horowitz, S.B., Sheplak, M., Cattafesta, L.N. III, Nishida, T., J. Micromech. Microeng. 16, S174 (2006)CrossRef
Si, P., Hu, A.P., Malpas, S., Budgett, D., IEEE Trans. Biomed. Circuits Syst. 2, 22 (2008)CrossRef
Sawan, M., Hashemi, S., Sehil, M., Awwad, F., Hajj-Hassan, M., Khouas, A., Biomed. Microdevices 11, 1059 (2009)CrossRef
Samad, N.A., Vaithianathan, T., Aziz, S.M., Brander, C.E., Design of a Wireless Power Supply Receiver for Biomedical Applications, in IEEE Asia-Pacific Conf. on Circuits and Systems, Singapore, 2006, pp. 674677Google Scholar
Rodrguez, G.A.A., Rossi, C., Esteve, D., Sens. Actuat. A 126, 201 (2006)CrossRef
Suster, M., Young, D.J., Ko, W.H., Micro-power wireless transmitter for high-temperature MEMS sensing and communication applications, in Proc. of the IEEE Micro Electro Mechanical Systems (MEMS), Las Vegas NV, USA, 2002, pp. 641644Google Scholar
Sauer, C., Cauwenberghs, G., IEEE Trans. Circuits Syst. 52, 2605 (2005)CrossRef
Salim, A., Baldi, A., Ziaie, B., Inductive Link Modeling and Design Guidelines for Optimum Power Transfer in Implantable Wireless Microsystems, in Proc. of 25th Annu. Int. Conf. of the IEEE EMBS, Cancun, Mexico, 2003Google Scholar
Catrysse, M., Hermans, B., Puers, R., Sens. Actuat. A 115, 221 (2004)CrossRef
Gao, J., IEEE Trans. Power Delivery 22, 507 (2007)CrossRef
Wang, K., Yan, G., Jiang, P., Ye, D., IEEE Trans. Robot. 24, 206 (2008)CrossRef
Cheng, D.K., Field and Wave Electromagnetics, 2nd edn. (Addison-Wesley, USA, 1989)Google Scholar
O’Neil, P.V., Advanced Engineering Mathematics, 6th edn. (Thomson, Toronto, 2007)Google Scholar
Tsai, N.-C., Liou, J.-S., Lin, C.-C., Li, T., Sens. Actuat. A 157, 68 (2010)CrossRef
Tsai, N.-C., Liou, J.-S., Lin, C.-C., Li, T., Int. J. Electromagn. Anal. Appl. 2, 362 (2010)
Tsai, N.-C., Liou, B.-H., Lin, C.-C., Microsyst. Technol. 15, 1793 (2009)CrossRef
MICROCHEM Company, http://www.microchem.com/